ITW Chemtronics 60 Soder-Wick® No-Clean ESD Desoldering Braid
- MFR #60
- EIS #PH19-60
- Series #60
$6.90 - $14.91
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more info
Pack--| Stock Status | ||||
|---|---|---|---|---|
 | 10 ft | 0.06 Inch | $ / each Pack: 25 SD Bobbin/Performance Pak� more info | |
 | 5 ft | 0.03 Inch | $ / each Pack: 25 SD Bobbin/Performance Pak� more info | |
 | 10 ft | 0.03 Inch | $ / each Pack: 25 SD Bobbin/Performance Pak� | |
 | 10 ft | 0.08 Inch | $ / each Pack: 25 SD Bobbin/Performance Pak� more info | |
 | 5 ft | 0.08 Inch | $ / each Pack: 25 SD Bobbin/Performance Pak� more info | |
 | 10 ft | 0.11 Inch | $ / each Pack: 25 SD Bobbin/Performance Pak� |
Soder-Wick no-clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick no-clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. - Soder-Wick no-clean SD is available on ESD safe bobbins for protection against damage due to static electricity. Minimizes the risk of damage associated with static electricity. Patented non-corrosive, halide-free, organic no-clean flux.
Features
- Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
- Requires little or no post solder cleaning
- Non-corrosive residues
- Halide free
- Minimal risk of heat and static component damage
Applications
- For Lugs and Posts, Micro Circuits, Surface Mount Device Pads and Ball Grid Array Pads
General Information
| Item Name | Desoldering Braid |
| Trade Name | Soder-Wick® |
| Series | 60 |
General Features
| Shelf Life | 24 Months |
Design & Construction
| Flux Type | No-Clean |
| Material | Copper |
Documents
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