ITW Chemtronics 40 Soder-Wick® No-Clean Desoldering Braid, 0.060" x 10', Yellow, 25 Static Dissipative Bobbins/Case, MFR ID 40-2-10
- MFR #40-2-10
- EIS #CHE40-2-10
- Series #40
- UPC #032599096751
$12.57 / Package
Pack: 25 SD Bobbin/Case
Available to Order
Refine your product below or compare all choices in the
Min QTY1QTY Increment1
more info
Pack25 SD Bobbin/Case| Stock Status | ||||
|---|---|---|---|---|
 | 10 ft | 0.06 Inch | $ / Package Pack: 25 SD Bobbin/Case |
Soder-Wick lead-free is the state of the art in desoldering technology. It is specially designed for removal of today's high temperature lead-free solders. The single layer weave used for Soder-Wick lead free braid is lighter in mass than any other desoldering braid available and allows for lead-free solder removal at lower temperatures. - Soder-Wicklead-free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less "contact" time thus preventing heat damage to the PCB and sensitive components.
Features
- Engineered specifically for high temperature, lead-free solders
- Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
- Specifically designed for all lead-free solders
- Can also be used with tin/lead solders
- Soder-Wick lead-free packaged in ESD safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Non-corrosive ultra high purity no-clean flux
- Will not leave ionic contamination on the boards
- Especially effective at removing residual solder from SMT pads
- Fastest wicking and heat transfer
- High capacity for solder uptake
- Halide-free, no-corrosive residues
- Minimizes risk of heat damage to pads, components and PCB
- Engineered specifically for high temperature, lead-free solders
- Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
- Specifically designed for all lead-free solders
- Can also be used with tin/lead solders
- Soder-Wick lead-free packaged in ESD safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Non-corrosive ultra high purity no-clean flux
- Will not leave ionic contamination on the boards
- Especially effective at removing residual solder from SMT pads
- Fastest wicking and heat transfer
- High capacity for solder uptake
- Halide-free, no-corrosive residues
- Minimizes risk of heat damage to pads, components and PCB
- Braid size of #2
Applications
- For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script
General Information
| Item Name | Desoldering Braid |
| Trade Name | Soder-Wick® |
| Series | 40 |
General Features
| Type | Lead Free |
| Shelf Life | 24 Months |
Design & Construction
| Color | Yellow |
| Flux Type | No-Clean |
| Material | Copper |
Physical Properties
| Length | 10 ft |
| Width | 0.06 Inch |
Documents
No Documents Found