ITW Chemtronics 40 Soder-Wick® No-Clean Desoldering Braid, 0.060" x 10', Yellow, 25 Static Dissipative Bobbins/Case, MFR ID 40-2-10
- MFR #:40-2-10
- EIS #:CHE40-2-10
- Series #:40
- UPC #:032599096751
- MFR #:40-2-10
- EIS #:CHE40-2-10
- Series #:40
- UPC #:032599096751
Available to Order
Min Qty:1
|Qty Increment:1
Pack:25 SD Bobbin/Case
Soder-Wick lead-free is the state of the art in desoldering technology. It is specially designed for removal of today's high temperature lead-free solders. The single layer weave used for Soder-Wick lead free braid is lighter in mass than any other desoldering braid available and allows for lead-free solder removal at lower temperatures. - Soder-Wicklead-free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less "contact" time thus preventing heat damage to the PCB and sensitive components.
$12.20 / Package
Pack: 25 SD Bobbin/Case
Min Qty:1
|Qty Increment:1
Pack:25 SD Bobbin/Case
Soder-Wick lead-free is the state of the art in desoldering technology. It is specially designed for removal of today's high temperature lead-free solders. The single layer weave used for Soder-Wick lead free braid is lighter in mass than any other desoldering braid available and allows for lead-free solder removal at lower temperatures. - Soder-Wicklead-free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less "contact" time thus preventing heat damage to the PCB and sensitive components.
Product Options
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 | Length: 10 ft | Width: 0.06 Inch | EIS Part #: CHE40-2-10 | $ / Package Pack: 25 SD Bobbin/Case |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameDesoldering Braid
Trade NameSoder-Wick®
Series40
General Features
TypeLead Free
Shelf Life24 Months
Design & Construction
ColorYellow
Flux TypeNo-Clean
MaterialCopper
Physical Properties
Length10 ft
Width0.06 Inch
Features
- Engineered specifically for high temperature, lead-free solders
- Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
- Specifically designed for all lead-free solders
- Can also be used with tin/lead solders
- Soder-Wick lead-free packaged in ESD safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Non-corrosive ultra high purity no-clean flux
- Will not leave ionic contamination on the boards
- Especially effective at removing residual solder from SMT pads
- Fastest wicking and heat transfer
- High capacity for solder uptake
- Halide-free, no-corrosive residues
- Minimizes risk of heat damage to pads, components and PCB
- Engineered specifically for high temperature, lead-free solders
- Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
- Specifically designed for all lead-free solders
- Can also be used with tin/lead solders
- Soder-Wick lead-free packaged in ESD safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Non-corrosive ultra high purity no-clean flux
- Will not leave ionic contamination on the boards
- Especially effective at removing residual solder from SMT pads
- Fastest wicking and heat transfer
- High capacity for solder uptake
- Halide-free, no-corrosive residues
- Minimizes risk of heat damage to pads, components and PCB
- Braid size of #2
Applications
- For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script