Henkel BERGQUIST® SIL PAD® TSP 1600S, MFR ID 2191274
- EIS #BERG2191274
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BERGQUIST® SIL PAD® TSP 1600S is a silicone-based, thermally conductive and electrically insulating general purpose thermal interface solution. It is fiberglass reinforced, with a smooth and highly compliant surface with high thermal conductivity. These features minimize thermal resistance and maximize thermal performance.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Features
- Thermal impedance: 0.61°C (33°F) -in2/W @ 50 psi
- Electrically isolating
- Value material
- Smooth and highly compliant surface
- Low mounting pressures
- Electrically insulating pad - general purpose
Specifications
Standard thickness: 0.229 mm
Thermal conductivity: 1.6 W/mK
Technology: Silicone
Color: Pink
Carrier type: Fiberglass
Flame rating: V-0
Operating temperature: -60.0 °C - 180.0 °C
General Information
| Item Name | BERGQUIST® SIL PAD® TSP 1600S |
General Features
| Shelf Life | 12 MON |
Physical Properties
| Container Type | Sheet |
| Pad Type | Gap Pad |
Supporting Information
| Use With | Thermal management, sil pads, Thermal management, gap pads, Thermal management |
Documentos
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