Henkel BERGQUIST® GAP PAD® TGP 1000VOUS, MFR ID 2191190
- EIS #BERG2191190
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BERGQUIST® GAP PAD® TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Compliance & Handling
Dangerous Goods: No Dangerous Good
Features
- Highly conformable, low hardness
- Thermal conductivity: 1.0 W/m-K
- High dielectric strength
- Decreased strain
- Ultra soft, fibreglass-reinforced insulation pad - high voltage applications
Specifications
Technology: Silicone
Color: Pink
Carrier type: Fiberglass
Standard thickness: 0.508 mm - 6.35 mm
Young's modulus, ASTM D575: 55.0 KPa ( 8.0 psi )
Operating temperature: -60.0 °C - 200.0 °C
Thermal conductivity: 1.0 W/mK
General Information
| Item Name | BERGQUIST® GAP PAD® TGP 1000VOUS |
General Features
| Shelf Life | 12 MON |
Physical Properties
| Container Type | Sheet |
| Pad Type | Gap Pad |
Supporting Information
| Use With | Specialties, others, Thermal management, circuits and substrates, Thermal management, sil pads |
Documentos
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