Henkel BERGQUIST® SIL PAD® TSP 1800, MFR ID 2190752
- EIS #BERG2190752
$7,296.45 / Sheet
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BERGQUIST® SIL PAD® TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient repositioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Features
- Thermal impedance: 0.53°C (32.9°F) -in2/W (@50 psi)
- Exceptional thermal performance at lower application pressures
- Superior breakdown voltage and surface wet-out values
- Smooth and non-tacky on both sides for easy repositioning and assembly error reduction
- Electrically insulating, fibreglass-reinforced - exceptional performance
Specifications
Standard thickness: 0.229 mm - 0.406 mm
Thermal conductivity: 1.8 W/mK
Technology: Silicone
Color: Black
Carrier type: Fiberglass
Flame rating: V-0
General Information
| Item Name | BERGQUIST® SIL PAD® TSP 1800 |
General Features
| Shelf Life | 6 MON |
Physical Properties
| Container Type | Sheet |
| Pad Type | Sil Pad |
Supporting Information
| Use With | Thermal management, sil pads, Thermal management |
Documentos
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