Henkel BERGQUIST® GAP PAD® TGP HC3000, MFR ID 2167600
- EIS #BERG2167600
$264.36 / Sheet
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Cantidad mínima1QTY Increment1
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BERGQUIST® GAP PAD® TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications requiring low stress on components and boards during assembly.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: 72
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: 72
Features
- Thermal conductivity: 3.0 W/m-K
- High compliance, low compression stress
- Fiberglass-reinforced for shear and tear resistance
- Soft, fiberglass-reinforced insulation pad for low stress applications
Specifications
Carrier type: Fiberglass
Standard thickness: 0.508 mm - 3.175 mm
Technology: Silicone
Thermal conductivity: 3.0 W/mK
Operating temperature: -60.0 °C - 200.0 °C
Flame rating: V-0
Young's modulus, ASTM D575: 110.0 KPa ( 16.0 psi )
Color: Blue
General Information
| Item Name | BERGQUIST® GAP PAD® TGP HC3000 |
General Features
| Shelf Life | 12 MON |
Physical Properties
| Container Type | Sheet |
| Pad Type | Gap Pad |
Supporting Information
| Use With | Thermal management, silicone pads, Thermal management, gap pads, Thermal management |
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