Henkel BERGQUIST® GAP PAD® TGP 1100SF, MFR ID 2166364
- EIS #BERG2166364
$250.86 / Sheet
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Cantidad mínima1QTY Increment1
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BERGQUIST® GAP PAD TGP 1100SF is a silicone-free, thermally conductive gap pad. Being silicone free, there is no silicone outgassing and silicone extraction. It is not only thermally conductive but also electrically isolating. This product is therefore ideal for silicone sensitive applications.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Specifications
Color: Green
Standard thickness: 0.254 mm - 3.175 mm
Carrier type: Fiberglass
Thermal conductivity: 0.9 W/mK
Flame rating: V-1
Operating temperature: -60.0 °C - 125.0 °C
General Information
| Item Name | BERGQUIST® GAP PAD® TGP 1100SF |
General Features
| Shelf Life | 12 MON |
Physical Properties
| Container Type | Sheet |
| Pad Type | Gap Pad |
Supporting Information
| Use With | Thermal management, Thermal management, gap pads, Thermal management, sil pads |
Documentos
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