Kester 495740050 Ultrapure® Lead-Free Bar Solder, Sn99.3 Cu0.7 (K100LD), 1.66 lb
MFR #:44-9574-0050
EIS #:SN99.3ULTRAPURE
Series #:K100LD
MFR #:44-9574-0050
EIS #:SN99.3ULTRAPURE
Series #:K100LD
In Stock
Min Qty:1
|Qty Increment:1
Pack:15 Bars/Case
K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. - K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.
$48.10 / US pound
Pack: 15 Bars/Case
Min Qty:1
|Qty Increment:1
Pack:15 Bars/Case
K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. - K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameBar Solder
Trade NameUltrapure®
SeriesK100LD
General Features
TypeLead-Free
Net Weight25 lb
Design & Construction
FormSolid
Physical Properties
AlloySn99.3 Cu0.7 (K100LD)
Weight1.66 lb
Environmental Condition
Melting Range221 °C
Features
- 20% Lower dross rate than Sn63Pb37 in laboratory tests
- Bright, smooth solder joints with no visible shrinkage effects
- Eutectic alloy
- Excellent through hole penetration and topside fillet
- Less corrosive to solder pots than SAC305
- Low cost, lead-free alloy
- Low dissolution of copper from boards and components into solder pot
- Contains halogen
- Melting range of 221 to 245 °C
Applications
- For Wave, Selective and Dip Tinning Operations