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Kester 495740050 Ultrapure® Lead-Free Bar Solder, Sn99.3 Cu0.7 (K100LD), 1.66 lb

The image shown is representative of the product family and may not specifically be the individual item.  K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the …

MFR #:495740050

EIS #:SN99.3ULTRAPURE

Series #:K100LD

MFR #:495740050

EIS #:SN99.3ULTRAPURE

Series #:K100LD

Inventory Not Available

Min Qty:1

  |  

Qty Increment:1

Pack:15 Bars/Case

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K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. - K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.
$55.64 / US pound

Min Qty:1

  |  

Qty Increment:1

Pack:15 Bars/Case

0
0
K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. - K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

Attributes

General Information
Item NameBar Solder
Trade NameUltrapure®
SeriesK100LD
General Features
Net Weight25 lb
TypeLead-Free
Design & Construction
FormSolid
Physical Properties
Weight1.66 lb
AlloySn99.3 Cu0.7 (K100LD)
Environmental Condition
Melting Range221 °C