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Kester 495740050 Ultrapure® Lead-Free Bar Solder, Sn99.3 Cu0.7 (K100LD), 1.66 lb

The image shown is representative of the product family and may not specifically be the individual item. K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the …
  • MFR #:44-9574-0050
  • EIS #:SN99.3ULTRAPURE
  • Series #:K100LD
  • MFR #:44-9574-0050
  • EIS #:SN99.3ULTRAPURE
  • Series #:K100LD
Available to Order

Min Qty:1

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Qty Increment:1

Pack:15 Bars/Case

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K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. - K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.
$61.33 / US pound
Pack: 15 Bars/Case

Min Qty:1

  |  

Qty Increment:1

Pack:15 Bars/Case

0
0
K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. - K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

Attributes

General Information

Item NameBar Solder
Trade NameUltrapure®

SeriesUltrapure High-Reliability

General Features

TypeLead-Free
Net Weight25 lb

Design & Construction

FormSolid

Chemical Properties

Lead FreeYes

Physical Properties

AlloyK100LD
Container Size1.66 LB
Container TypeSpool
Weight1.66 lb

Environmental Condition

Melting Range221 °C

Supporting Information

Compatible Desoldering ToolPH1915103 - Solder Bar