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Loctite 5404 Thermally Conductive Adhesive, 300mL Cartridge, White, MFR ID 232221

The image shown is representative of the product family and may not specifically be the individual item. SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various h…
  • MFR #:232221
  • EIS #:LOC26665
  • Series #:5404
  • MFR #:232221
  • EIS #:LOC26665
  • Series #:5404
Available to Order

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
more info
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SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. LOCTITE® SI 5404 is a 1-part, white to grey, heat-cured industrial silicone that is thermally conductive. The product offers a high Shore A hardness of 60 and is used typically to bond metallic heat sinks, ceramic chips and circuit board substrates. It combines good electrical isolation and high thermal conductivity. The product also delivers load bearing and shock absorbing characteristics to the bond area.
$461.21 / each

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
more info
0
0
SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. LOCTITE® SI 5404 is a 1-part, white to grey, heat-cured industrial silicone that is thermally conductive. The product offers a high Shore A hardness of 60 and is used typically to bond metallic heat sinks, ceramic chips and circuit board substrates. It combines good electrical isolation and high thermal conductivity. The product also delivers load bearing and shock absorbing characteristics to the bond area.

Attributes

General Information

Item NameThermally Conductive Adhesive
Trade NameHenkel

SeriesLOC-5404

General Features

Storage Temperature2 to 8 °C

Design & Construction

ColorWhite
Cure TypeHeat Cure
FormPaste

Performance Details

Full Cure Time1 hr at 150 °C
Tensile Strength>/=188 psi

Chemical Properties

CompositionSilicone
Specific Gravity2.3
VOC32.1g/L

Electrical Properties

Dielectric Strength19.2kV/mm

Physical Properties

Container Size300mL
Container TypeCartridge
Elongation>/=65%
Hardness53 - 63 Shore A