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Loctite 5404 Thermally Conductive Adhesive, 300mL Cartridge, White

ID: LOC26665 Mfr ID: 26665
Manufactured by: Loctite Electronics
SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink.

USD $272.48 / EA

In Stock

 Future Availability 

This item may be sold in units of 1.

Order Form
  • Brand name :  Loctite
  • Series :  LOC-5404
  • Item Name :  Thermally Conductive Adhesive
  • Short Desc :  26665 5404 THERM. COND. ADH. 300ML CART
  • UNSPSC :  31201600

A typical application would be the bonding of any power semiconductor, module, graphics processor or other heat generating device to a heat sink or metal enclosure in an electronics circuit.

Performance Details
Full Cure Time 1 hr at 150 deg C 
Elongation >/=65% 
Tensile Strength >/=188 psi 
Design & Construction
Form Paste 
Color White 
Cure Type Heat Cure 
Electrical Properties
Dielectric Strength 19.2kV/mm 
Chemical Properties
Composition Silicone 
Specific Gravity 2.3 
VOC 32.1g/L 
Physical Properties
Container Size 300mL 
Container Type Cartridge 
Hardness 53 - 63 Shore A 

Loctite 5404 Thermally Conductive Adhesive, 300mL Cartridge, White Technical Data Sheet 

Features :

  • Specific gravity of 2.3 - 2.45

Applications :

  • For Bonding Transformers, Transistors and Other Heat Generating Electronic Components to Printed Circuit Board Assemblies or Heat Sinks