SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. LOCTITE® SI 5404 is a 1-part, white to grey, heat-cured industrial silicone that is thermally conductive. The product offers a high Shore A hardness of 60 and is used typically to bond metallic heat sinks, ceramic chips and circuit board substrates. It combines good electrical isolation and high thermal conductivity. The product also delivers load bearing and shock absorbing characteristics to the bond area.