Von Roll/John C Dolph Dolphon® CC-1115 Solventless VPI Epoxy Resin
MFR #:Dolphon® CC-1115
EIS #:PH21-Dolphon CC-1115
MFR #:Dolphon® CC-1115
EIS #:PH21-Dolphon CC-1115
Von Roll/John C Dolph Dolphon® CC-1115 Solventless VPI Epoxy Resin, Epoxy Base Type, 2,200 V/Mil (ASTM D 115) Dielectric Strength, >200 °F Flash Point, 15 - 23 min At 285 °F (140 °C), ASTM D 3056 Gel Time, 80 - 90 Shore D (ASTM D 2240) Hardness, 11000 – 17000 cps (At 1 rpm 77 °F (25 °C), ASTM D1475), 4000 - 6000 cps (At 10 rpm 77 °F (25 °C), ASTM D1475) Viscosity. - CC-1115 is a unique thixotropic epoxy resin for vacuum pressure impregnation of random wound motors and form wound coils.
$173.50
- $467.14
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Von Roll/John C Dolph Dolphon® CC-1115 Solventless VPI Epoxy Resin, Epoxy Base Type, 2,200 V/Mil (ASTM D 115) Dielectric Strength, >200 °F Flash Point, 15 - 23 min At 285 °F (140 °C), ASTM D 3056 Gel Time, 80 - 90 Shore D (ASTM D 2240) Hardness, 11000 – 17000 cps (At 1 rpm 77 °F (25 °C), ASTM D1475), 4000 - 6000 cps (At 10 rpm 77 °F (25 °C), ASTM D1475) Viscosity. - CC-1115 is a unique thixotropic epoxy resin for vacuum pressure impregnation of random wound motors and form wound coils.
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 | Container Size: 1 gal | Color: Translucent | EIS Part #: DOLCC1115G | $ / US gallon |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameVPI Epoxy Resin
Trade NameDolphon®
SeriesDolphon® CC-1115
General Features
Net Weight9.0 - 9.8 lb/gal
TypeSolventless
Design & Construction
Base TypeEpoxy
Performance Details
Gel Time15 min
Technical Details
Flash Point200 °F
Chemical Properties
Viscosity11000 cP
Electrical Properties
Dielectric Strength2200 V/Mil
Physical Properties
Hardness80 - 90 Shore D (ASTM D2240)
Features
- Excellent moisture resistance, pre-catalyzed
- Excellent chemical resistance, High flash point
- Good thermal shock properties, exceptional tank stability
- Improves impregnation and reduces processing time without affecting resin stability
- Thixotropic
- Minimum drain during cure
- Excellent appearance
- 2.5 - 3.0 thixotropic index
- 3 - 5 Mils/side (ASTM D 115) film build
- 50 lbs at 25 °C, 7 lbs at 150 °C helical coil bond strength
- 3.24 at 25 °C, 100 Hz (ASTM D-150) dielectric constant
- 0.023 at 25 °C, 100 Hz (ASTM D-150) dissipation factor
- 3.7 x 10^14 ohms (ASTM D 257) surface resistivity
- 2.74 x 10^16 ohm-cm (ASTM D 257) volume resistivity
- Gel Time: 15 - 23 min
Applications
- Motors
- Stators
- Random Wound Coils
- Form Wound Coils
- DC Armatures
- Rotating Fields