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Loctite 5404 Thermally Conductive Adhesive, 300mL Cartridge, White

The image shown is representative of the product family and may not specifically be the individual item.  SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various h…

MFR #:232221

EIS #:LOC26665

Series #:5404

MFR #:232221

EIS #:LOC26665

Series #:5404

Out of Stock

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
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SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. LOCTITE® SI 5404 is a 1-part, white to grey, heat-cured industrial silicone that is thermally conductive. The product offers a high Shore A hardness of 60 and is used typically to bond metallic heat sinks, ceramic chips and circuit board substrates. It combines good electrical isolation and high thermal conductivity. The product also delivers load bearing and shock absorbing characteristics to the bond area.
$438.45 / each

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
0
0
SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. LOCTITE® SI 5404 is a 1-part, white to grey, heat-cured industrial silicone that is thermally conductive. The product offers a high Shore A hardness of 60 and is used typically to bond metallic heat sinks, ceramic chips and circuit board substrates. It combines good electrical isolation and high thermal conductivity. The product also delivers load bearing and shock absorbing characteristics to the bond area.

Attributes

General Information
Item NameThermally Conductive Adhesive
Trade NameHenkel
SeriesLOC-5404
General Features
Storage Temperature2 to 8 °C
Design & Construction
ColorWhite
Cure TypeHeat Cure
FormPaste
Performance Details
Full Cure Time1 hr at 150 °C
Tensile Strength>/=188 psi
Chemical Properties
CompositionSilicone
Specific Gravity2.3
VOC32.1g/L
Electrical Properties
Dielectric Strength19.2kV/mm
Physical Properties
Container Size300mL
Container TypeCartridge
Elongation>/=65%
Hardness53 - 63 Shore A