Loctite 3627 Chipbonder® One-Part Surface Mount Adhesive, MFR ID LOC-3627
MFR #:LOC-3627
EIS #:PH11-LOC-3627
Series #:LOC-3627
MFR #:LOC-3627
EIS #:PH11-LOC-3627
Series #:LOC-3627
Loctite 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - The product is also suitable for stencil print applications. Loctite 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
$120.57
- $592.63
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Loctite 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - The product is also suitable for stencil print applications. Loctite 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
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Container Size:
300mL
Container Type:
Semco Cartridge
EIS Part #:
LOC37679
$ / Cartridge
Pack: 2/Carton
Container Size:
10mL
Container Type:
Iwashita Syringe
EIS Part #:
LOC37671
$ / Piece
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Attributes
Features
Applications
Attributes
General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®
SeriesLOC-3627
General Features
TypeOne-Part
Storage Temperature2 to 8 °C
Design & Construction
ColorRed
Cure TypeHeat Cure
FormLiquid, Paste
Performance Details
Full Cure Time90 sec at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity1.353
Viscosity2 - 5 Pa at 25 °C
Physical Properties
Density1.16g/cc
Odor/ScentCharacteristic
Features
Fast cure formula
High wet strength
Dek Pro-Flow compatible
Lead-free compatible
Applications
For the Bonding of Surface Mounted Devices to Printed Circuit Boards Prior to Wave Soldering