Loctite 3609 Chipbonder® One-Part Surface Mount Adhesive, MFR ID LOC-3609
MFR #:LOC-3609
EIS #:PH11-LOC-3609
Series #:LOC-3609
MFR #:LOC-3609
EIS #:PH11-LOC-3609
Series #:LOC-3609
Loctite 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - Loctite 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the environmental resistance section.
$79.09
- $202.06
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Loctite 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. - Loctite 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the environmental resistance section.
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Container Size:
20mL
Container Type:
Syringe
EIS Part #:
LOC21555
$ / each
Container Size:
10mL
Container Type:
EFD Syringe
EIS Part #:
LOC20236
$ / each
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Attributes
Features
Applications
Attributes
General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®
SeriesLOC-3609
General Features
TypeOne-Part
Shelf Life6 Months
Storage Temperature2 to 8 °C
Design & Construction
ColorRed, Orange
Cure TypeHeat Cure
FormLiquid
Performance Details
Full Cure Time90 sec at 150 °C
Shear Strength1450 psi at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity1.1
VOC2.46g/L
Electrical Properties
Dielectric StrengthSee TDS
Physical Properties
Odor/ScentMild Petroleum
Supporting Information
Application MethodHigh Speed Syringe Dispensing
Features
One-component requires no mixing and is heat cure
Medium dispense speed of 15000 - 25000 dots/hr
Good green strength
Red for best vision pickup on light surfaces
Particularly suited where high speed, high dot profile, high wet strength and high electrical specifications are required