Kester 979 No-Clean Soldering Flux
- MFR #979
- EIS #PH19-979
- Series #979
$85.16 - $96.26
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Pack--| Stock Status | |||
|---|---|---|---|
 | 1 gal | $ / US gallon | |
 | 5 gal | $ / US gallon more info | |
| 53 gal | $ / US gallon more info |
The Kester 979 is a VOC-free, no-clean flux formulation for high quality, low-defect soldering of electronic circuit board assemblies. This flux's finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. 979 also reduces micro solderballing on glossy laminates and between connector pins. - 979 will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. 979 leaves a minimal amount of residue after soldering. All remaining residues are non-corrosive, non-conductive and do not need to be removed.
Features
- Biodegradable at pH of 2 or greater
- Chemically compatible with most solder masks and board laminates
- Does not degrade surface insulation resistance
- No offensive odors
- Bright, shiny solder connections
- Temperature rating of 90 to 115 °C
- Vapor pressure of 23 hPa at 20 °C
General Information
| Item Name | Soldering Flux |
| Series | 979 |
General Features
| Shelf Life | 12 Months |
| Storage Temperature | 4 to 25 °C |
Design & Construction
| Color | Clear |
| Flux Type | No-Clean |
| Form | Liquid |
Performance Details
| Vapor Pressure | 23 hPa |
Chemical Properties
| Chemical Composition | Aliphatic Carboxylic Acid, Bis(2-(2-Methoxyethoxy)Ethyl) Ether, Water |
| Flux Formula | 979 |
| Specific Gravity | 1.02 |
Physical Properties
| Odor/Scent | Mild |
Supporting Information
| Flux Designator | ORL0 |
| RoHS Info | 2011/65/EU Directive |
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