Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. - Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule.
$715.26
- $2,028.31
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Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. - Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule.
Product Options
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Container Size:
4.9kg
Color:
Off White
EIS Part #:
DC170X4.9KG-B
$ / Pail
Container Size:
4.9kg
Color:
Black
EIS Part #:
DC170X4.9KG-A
$ / Pail
Container Size:
22.6kg
Color:
Off White
EIS Part #:
DC170X22.6KG-B
$ / Pail
Container Size:
22.6kg
Color:
Black
EIS Part #:
DC170X22.6KG-A
$ / Pail
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Attributes
Features
Applications
Attributes
General Information
Item NameSilicone Elastomer
Trade NameSylgard®
Series170
General Features
StandardsWEEE/RoHS Compliant
Design & Construction
Cure TypeRoom Temperature/Heat Cure
FormLiquid
Chemical Properties
CompositionSilicone
Specific Gravity1.37
Physical Properties
Container TypePail
Hardness47 Shore A
Odor/ScentSlight
Features
Low viscosity
Rapid room temperature or heat accelerated cure
Moderate thermal conductivity
Rapid, versatile cure processing controlled by temperature
Shorter room temperature cure reduces cycle time
Low viscosity enhances flow and fill in narrow spaces and around complex geometries
Can be considered for uses requiring added flame resistance
Thermosetting thermal resistance
High and low temperature stable
Applications
For use as a General Potting Material for Power Supplies, Connectors, Sensors, Industrial Controls, Transformers, Amplifiers, High Voltage Resistor Packs, Relays