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Zestron 0930-0025 Atron Flux Remover, 25L Jerry Can, Clear

The image shown is representative of the product family and may not specifically be the individual item. Vigon EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. This product can also …

MFR #:0930-0025

EIS #:0930-0025-ZES

Series #:SP200

MFR #:0930-0025

EIS #:0930-0025-ZES

Series #:SP200

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Aqueous-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps from reflow or wave solder systems. The cleaning agent can also be used for the removal of unsoldered solder pastes from SMT stencils and is suitable for air assisted, ultrasonic and spray-in-air cleaning equipment.
$420.55 / Can

Min Qty:1

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Qty Increment:1

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Aqueous-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps from reflow or wave solder systems. The cleaning agent can also be used for the removal of unsoldered solder pastes from SMT stencils and is suitable for air assisted, ultrasonic and spray-in-air cleaning equipment.

Attributes

General Information
Item NameFlux Remover
Trade NameAtron
SeriesSP 200
General Features
StandardsRoHS 1, 2 & 3, WEEE, REACH compliant, Free of critical substances (SIN & SVHC lists)
Net Weight25 L
Shelf LifeMinimum 5 years
Storage Temperature5 to 30 C
Design & Construction
ColorClear
FormLiquid
Performance Details
RemovesBaked-on fluxes (all kinds), Solder pastes (unsoldered), Fumigation contamination, SMT & conductive adhesives
Vapor PressureApprox. 23 mbar at 20 C
Technical Details
Boiling Point100 C
Flash PointNone until boiling
Chemical Properties
pH Rating12 (10g/L H2O)
Physical Properties
Container Size25L
Container TypeJerry Can
Density1 g/cm3 at 20 C
Odor/ScentFeature
Environmental Condition
Temperature Rating20 to 50 C
Supporting Information
Applicable MaterialsSolder pallets, condensation traps, SMT stencils, conveyor fingers, aluminum, epoxy surfaces
For Use WithBaked-on fluxes, unsoldered solder pastes, SMT or conductive adhesives, and maintenance parts
Use WithAir-assisted systems, ultrasonic systems, spray-in-air systems
Solubility In WaterSoluble