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Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin

The image shown is representative of the product family and may not specifically be the individual item.

MFR #:Dolphon® CB-1109

EIS #:PH21-Dolphon CB-1109

MFR #:Dolphon® CB-1109

EIS #:PH21-Dolphon CB-1109

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Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin, Room Temperature Cure Type, 665 V/Mil Dielectric Strength, 180% Elongation, 24 hr Full Cure Time, 1100+/-20 g/Liter At 25 °C Specific Gravity, 300 psi Tensile Strength, 0.33/0.36 W/mK Thermal Conductivity, 4500/8500 cps Viscosity. - CB-1109 is a unique, flexible resin. an alternative to silicone, urethane and epoxy resins, it can be used for potting, casting and coating electrical and electronic device applications where flexibility is required.
$29.54
 - $41.16
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Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin, Room Temperature Cure Type, 665 V/Mil Dielectric Strength, 180% Elongation, 24 hr Full Cure Time, 1100+/-20 g/Liter At 25 °C Specific Gravity, 300 psi Tensile Strength, 0.33/0.36 W/mK Thermal Conductivity, 4500/8500 cps Viscosity. - CB-1109 is a unique, flexible resin. an alternative to silicone, urethane and epoxy resins, it can be used for potting, casting and coating electrical and electronic device applications where flexibility is required.

Product Options

Showing 2 out of 2 options
Container Size
1 gal
EIS Part #
DOLCB1109G
$ / US pound
Container Size
5 gal
EIS Part #
DOLCB110945LB
$ / US pound

Attributes

General Information
Item NameFlexible Polybutadiene Resin
Trade NameDolphon®
SeriesDolphon® CB-1109
General Features
TypeTwo-Part
Design & Construction
ColorBlack
Cure TypeRoom Temperature
Performance Details
Full Cure Time24 hr
Tensile Strength300 psi
Thermal Conductivity0.33 W/mK
Chemical Properties
Specific Gravity1100 g/L
Viscosity4500 cP
Electrical Properties
Dielectric Strength665 V/mil
Physical Properties
Elongation180%