MFR #:Dolphon® CC-1089
EIS #:DOLCC108916LB
MFR #:Dolphon® CC-1089
EIS #:DOLCC108916LB
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Min Qty:1
|Qty Increment:1
Dolphon CC-1089 is a semi-rigid, two package, rapid heat curing epoxy resin specifically formulated for impregnating and sealing electric motors using Dolphon Flow-On method.
Von Roll/John C Dolph Dolphon® CC-1089 Epoxy Flow-On Resin Reactor Kit, Epoxy Base Type, 450 V/Mil Dielectric Strength, 70 Shore D Hardness, 7500 psi Tensile Strength, 4.9 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity.
$225.22 / Kit
Min Qty:1
|Qty Increment:1
Dolphon CC-1089 is a semi-rigid, two package, rapid heat curing epoxy resin specifically formulated for impregnating and sealing electric motors using Dolphon Flow-On method.
Von Roll/John C Dolph Dolphon® CC-1089 Epoxy Flow-On Resin Reactor Kit, Epoxy Base Type, 450 V/Mil Dielectric Strength, 70 Shore D Hardness, 7500 psi Tensile Strength, 4.9 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity.
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Container Size: 16 lb | EIS Part #: DOLCC108916LB | $ / Kit |
- Attributes
- Features
Attributes
General Information
Item NameEpoxy Flow-On Resin Reactor Kit
Trade NameVon Roll John Cdolph
SeriesDolphon® CC-1089
Design & Construction
Base TypeEpoxy
ColorAmber
Performance Details
Tensile Strength7500 psi
Electrical Properties
Dielectric Strength450 V/Mil
Physical Properties
Container Size16 lb
Hardness70 Shore D
Features
- Short rapid process
- Supplied in kit form for easy measuring of resin and reactor
- Excellent electrical and physical properties
- Low viscosity for good penetration
- Excellent moisture and chemical resistance
- 0.10% (ASTM D-570) water absorption
- 5.0 x 10^12 ohms surface resistivity
- 1.0 x 10^16 Ohm-cm volume resistivity
- Thermal Conductivity: 4.9 x 10^-4 Cal/sec/cm^2/°C/cm