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Von Roll/John C Dolph Dolphon® CC-1149-HTC Solventless Epoxy Dip And Bake Resin

The image shown is representative of the product family and may not specifically be the individual item.
  • MFR #:Dolphon® CC-1149-HTC
  • EIS #:PH21-Dolphon CC-1149-HTC
  • MFR #:Dolphon® CC-1149-HTC
  • EIS #:PH21-Dolphon CC-1149-HTC
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Von Roll/John C Dolph Dolphon® CC-1149-HTC Solventless Epoxy Dip And Bake Resin, Epoxy Base Type, 1000 V/Mil (Dry, ASTM D 115) Dielectric Strength, >200 °F Flash Point, 60 - 90 min At 275 °F (135 °C), ASTM D 3056 Gel Time, 40 Shore D (ASTM D 2240) Hardness, 3500 - 4500 cps At 77 °F (25 °C), ASTM D2196 Viscosity. - CC-1149HTC is a solventless, epoxy resin that is moderate in viscosity and designed for dip and bake applications. CC-1149HTC is semi-rigid when cured. This is a thermally conductive version of the Dolphon CC-1149.
$236.22
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Von Roll/John C Dolph Dolphon® CC-1149-HTC Solventless Epoxy Dip And Bake Resin, Epoxy Base Type, 1000 V/Mil (Dry, ASTM D 115) Dielectric Strength, >200 °F Flash Point, 60 - 90 min At 275 °F (135 °C), ASTM D 3056 Gel Time, 40 Shore D (ASTM D 2240) Hardness, 3500 - 4500 cps At 77 °F (25 °C), ASTM D2196 Viscosity. - CC-1149HTC is a solventless, epoxy resin that is moderate in viscosity and designed for dip and bake applications. CC-1149HTC is semi-rigid when cured. This is a thermally conductive version of the Dolphon CC-1149.

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The image shown is representative of the product family and may not specifically be the individual item.
Container Size: 
5 gal
EIS Part #: 
DOLCC1149HTC5G
$ / US gallon

Attributes

General Information

Item NameEpoxy Dip and Bake Resin
Trade NameDolphon®

SeriesDolphon® CC-1149-HTC

General Features

Net Weight10.7 - 10.9 lb/gal
TypeSolventless

Design & Construction

Base TypeEpoxy
ColorOpaque

Performance Details

Gel Time60 min

Technical Details

Flash Point200 °F

Chemical Properties

Viscosity3500 cP

Electrical Properties

Dielectric Strength1000 V/Mil

Physical Properties

Hardness40 Shore D (ASTM D2240)