Von Roll/John C Dolph Dolphon® CB-1057 Epoxy Buttering Resin Reactor Kit
MFR #:Dolphon® CB-1057
EIS #:PH21-Dolphon CB-1057
MFR #:Dolphon® CB-1057
EIS #:PH21-Dolphon CB-1057
Von Roll/John C Dolph Dolphon® CB-1057 Epoxy Buttering Resin Reactor Kit, Epoxy Base Type, Room Temperature Cure Type, 430 V/Mil Dielectric Strength, 70 - 75 Shore D Hardness, 8100 psi Tensile Strength, 8 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity. - Dolphon CB-1057 is a flexible, two package, room temperature curing epoxy resin specifically formulated for encapsulation by buttering of electric motor.
$90.75
- $462.88
Select from the options below
Von Roll/John C Dolph Dolphon® CB-1057 Epoxy Buttering Resin Reactor Kit, Epoxy Base Type, Room Temperature Cure Type, 430 V/Mil Dielectric Strength, 70 - 75 Shore D Hardness, 8100 psi Tensile Strength, 8 x 10^-4 Cal/sec/cm^2/°C/cm Thermal Conductivity. - Dolphon CB-1057 is a flexible, two package, room temperature curing epoxy resin specifically formulated for encapsulation by buttering of electric motor.
Product Options
Showing 3 out of 3 options
 | Container Size: 1 lb | EIS Part #: DOLCB1057LB | $ / each | |
| Container Size: 8 lb | EIS Part #: DOLCB10578LB | $ / Kit | |
| Container Size: 2 lb | EIS Part #: DOLCB10572LB | $ / Kit |
- Attributes
- Features
Attributes
General Information
Item NameEpoxy Buttering Resin Reactor Kit
Trade NameDolphon®
SeriesDolphon® CB-1057
Design & Construction
Base TypeEpoxy
ColorBlack
Cure TypeRoom Temperature
Performance Details
Tensile Strength8100 psi
Electrical Properties
Dielectric Strength430 V/mil
Physical Properties
Hardness70 - 75 Shore D
Features
- Supplied in kit form for easy measuring of resin and reactor
- Different color of resin and reactor insures through mixing
- Cures quickly at room temperature
- Tough and rubbery film, withstands severe mechanical and thermal shock
- Thixotropic consistency, will not sag
- Excellent abrasion, moisture and chemical resistance
- 0.085% water absorption
- 5.0 x 10^12 ohms surface resistivity
- 1.1 x 10^14 Ohm-cm volume resistivity
- Thermal Conductivity: 8 x 10^-4 Cal/sec/cm^2/°C/cm