Dow 93-500 Thixotropic Space Grade Encapsulant, 110g Kit, MFR ID 93-500X110G
- MFR #:93-500
- EIS #:DC93-500X110G
- Series #:93-500
- MFR #:93-500
- EIS #:DC93-500X110G
- Series #:93-500
Available to Order
Min Qty:1
|Qty Increment:1
Dow Corning 93-500 space grade encapsulate is a transparent, room-temperature-curing, solventless silicone material designed for potting, filling, embedding and encapsulating electronic and other equipment for use in the space environment. It is supplied as a nearly colorless, free flowing, low viscosity fluid. - Dow Corning 93-500 encapsulate sections of the encapsulant can be cut out for replacement of components, new encapsulant can be poured in place and cured to re-form a tight seal.
$2,208.08 / Kit
Min Qty:1
|Qty Increment:1
Dow Corning 93-500 space grade encapsulate is a transparent, room-temperature-curing, solventless silicone material designed for potting, filling, embedding and encapsulating electronic and other equipment for use in the space environment. It is supplied as a nearly colorless, free flowing, low viscosity fluid. - Dow Corning 93-500 encapsulate sections of the encapsulant can be cut out for replacement of components, new encapsulant can be poured in place and cured to re-form a tight seal.
Product Options
Showing 2 out of 2 options
 | Container Size: 115g | EIS Part #: DC93-500X115G | $ / Kit | |
 | Container Size: 110g | EIS Part #: DC93-500X110G | $ / Kit |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameEncapsulant Kit
Series93-500
General Features
TypeThixotropic, Space Grade
Shelf Life6 Months
Storage TemperatureBelow 32 °C
Design & Construction
Cure TypeRoom Temperature
FormLiquid
Performance Details
Tensile Strength790 psi
Chemical Properties
CompositionSilicone Elastomer
Specific Gravity1.08
Viscosity8000 cSt
Electrical Properties
Dielectric Strength570V/Mil
Physical Properties
Container Size110g
Container TypeKit
Elongation110%
Hardness46 Shore A
Features
- Transparency - embedded parts can be visually inspected
- Good physical and electrical stability-retain properties from -65 to 200 °C (-85 to 392 °F), over a wide range of frequency and humidity
- Good firmness and flexibility - shore A scale hardness of approximately 45, elongation of about 100%
- Good damping qualities - low transmission of vibration and shock
- Good environmental protection - low water absorption less than 0.10% after 7 days immersion at 25 °C (77 °F), high resistance to radiation (usable after exposure to 200 megarads)
- Low shrinkage during cure - does not exert pressure on encapsulated or embedded components
Applications
- For Modules, Power Supplies, Cable Connectors or Complete Electronic Assemblies, Electronic Components, Circuit Boards and Solar Cell Adhesive