Von Roll/John C Dolph Dolphon® CC-1120 Two Part Elastomeric Potting Compound Resin
MFR #:Dolphon® CC-1120
EIS #:PH21-Dolphon CC-1120
MFR #:Dolphon® CC-1120
EIS #:PH21-Dolphon CC-1120
Von Roll Dolphon® CC-1120 Two Part Elastomeric Potting Compound Resin, Amber. - DOLPHON CC-1120 is a unique two-part, room temperature curing, potting compound with low viscosity and easy pourability.
$379.85
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Von Roll Dolphon® CC-1120 Two Part Elastomeric Potting Compound Resin, Amber. - DOLPHON CC-1120 is a unique two-part, room temperature curing, potting compound with low viscosity and easy pourability.
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Container Size:
1 gal
EIS Part #:
DOLCC1120G
$ / Kit
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Attributes
Features
Applications
Documents
Attributes
General Information
Item NameCompound Resin
Trade NameDolphon®
SeriesDolphon® CC-1120
General Features
TypeTwo Part Elastomeric Potting
Design & Construction
ColorAmber
Cure TypeRoom Temperature
Insulation TypeClass B
Performance Details
Full Cure Time3 - 5 hr
Gel Time8 min
Chemical Properties
Viscosity1400 cP
Electrical Properties
Dielectric Strength620 V/mil
Physical Properties
Container TypeKit
Density7.5 lb/gal
Hardness30 - 40 Shore D
Environmental Condition
Temperature Rating130 °C
Features
Convenient mix ratio
Easy mixing
Low viscosity for easy pouring over sand or fillers
Long pot life
Room temperature cure with low exotherm
Very low shrinkage
Easy removal and repair
Excellent electrical properties
High resistance to degradation by heat or pressure
Finished product can be used continuously at 150 °C and intermittently at temperatures up to 180 °C
No embedment stress
Flexible at temperatures as low as -65 °C
Removable
Repairable
Viscosity: 1400 to 1600 cps at 25 °C
Thermal Conductivity: 2.2 BTU-Inch/hr-ft^2- °F
Density: 7.5 - 8.0 lb/gal
Gel Time: 8 - 12 min
Viscosity: 1400 - 1600 cP
Applications
Filling Electromagnets, Potting Transformers
Potting Electronic Modules, Encapsulating Thick Film Circuits
Circuit Boards, Magnetic Chucks, Conformal Coating