Von Roll/John C Dolph Dolphon® CC-1120 Two Part Elastomeric Potting Compound Resin
MFR #:Dolphon® CC-1120
EIS #:PH21-Dolphon CC-1120
MFR #:Dolphon® CC-1120
EIS #:PH21-Dolphon CC-1120
Von Roll Dolphon® CC-1120 Two Part Elastomeric Potting Compound Resin, Amber. - DOLPHON CC-1120 is a unique two-part, room temperature curing, potting compound with low viscosity and easy pourability.
$342.15
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Von Roll Dolphon® CC-1120 Two Part Elastomeric Potting Compound Resin, Amber. - DOLPHON CC-1120 is a unique two-part, room temperature curing, potting compound with low viscosity and easy pourability.
Product Options
Showing 2 out of 2 options
 | Container Size: 1 gal | EIS Part #: DOLCC1120G | $ / Kit | |
| Container Size: 60 gal | EIS Part #: DOLCC112060G | $ / Kit |
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameCompound Resin
Trade NameDolphon®
SeriesDolphon® CC-1120
General Features
TypeTwo Part Elastomeric Potting
Design & Construction
ColorAmber
Cure TypeRoom Temperature
Insulation TypeClass B
Performance Details
Full Cure Time3 - 5 hr
Gel Time8 min
Chemical Properties
Viscosity1400 cP
Electrical Properties
Dielectric Strength620 V/mil
Physical Properties
Container TypeKit
Density7.5 lb/gal
Hardness30 - 40 Shore D
Environmental Condition
Temperature Rating130 °C
Features
- Convenient mix ratio
- Easy mixing
- Low viscosity for easy pouring over sand or fillers
- Long pot life
- Room temperature cure with low exotherm
- Very low shrinkage
- Easy removal and repair
- Excellent electrical properties
- High resistance to degradation by heat or pressure
- Finished product can be used continuously at 150 °C and intermittently at temperatures up to 180 °C
- No embedment stress
- Flexible at temperatures as low as -65 °C
- Removable
- Repairable
- Viscosity: 1400 to 1600 cps at 25 °C
- Thermal Conductivity: 2.2 BTU-Inch/hr-ft^2- °F
- Density: 7.5 - 8.0 lb/gal
- Gel Time: 8 - 12 min
- Viscosity: 1400 - 1600 cP
Applications
- Filling Electromagnets, Potting Transformers
- Potting Electronic Modules, Encapsulating Thick Film Circuits
- Circuit Boards, Magnetic Chucks, Conformal Coating