Henkel BERGQUIST® GAP PAD® TGP 12000, MFR ID 2705074

BERGQUIST® GAP PAD TGP 12000 is a soft gap filling material rated at a thermal conductivity of 12 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. The material offers exceptional thermal performance at low pressures. It is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: 55
Sensitive to Heat/Frost: Sensitive to Heat,Sensitive to Frost