Henkel BERGQUIST® SIL PAD® TSP K1100, MFR ID 2167686
- EIS #BERG2167686
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BERGQUIST® SIL PAD® TSP K1100 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against “cut-through” and resultant assembly failures.Options and ConfigurationsConfiguration - 12" x 12" sheets, 12" x 250 rolls or custom configurationAdhesive - Adhesive one side, no adhesiveStandard thickness - 0.006"Custom made configurations available upon request
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Features
- Thermal impedance 0.49°C-in2/W (@50 psi)
- Medium performance film
- Less sensitive to clamping pressure because of its smooth surface finish
- Physically strong dielectric barrier against cut-through
Specifications
Volume resistivity: 1×10 Ohm m
Operating temperature: -60.0 °C - 180.0 °C
Standard thickness: 0.152 mm
Flame rating: V-0
Thermal impedance, ASTM D5470 @ 50 psi: 0.49 °C-in²/W
Dielectric breakdown voltage: 6000.0 Vac
Dielectric constant, @ 1kHz: 4.0
Thermal conductivity: 1.1 W/mK
General Information
| Item Name | BERGQUIST® SIL PAD® TSP K1100 |
| Trade Name | Sil-Pad® K-6 |
General Features
| Shelf Life | 12 MON |
Physical Properties
| Container Type | Sheet |
| Hardness | 90 |
| Pad Type | Sil Pad |
Supporting Information
| Use With | Thermal management, sil pads, Thermal management |
Documents
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