Henkel BERGQUIST® GAP PAD® TGP 2200SF, MFR ID 2166845
- EIS #BERG2166845
$139.91 / Sheet
Available to Order
Min QTY1QTY Increment1
more info
BERGQUIST® GAP PAD® TGP 2200SF is a thermally conductive, electrically isolating polymer, ideal for silicone-sensitive applications with uneven topologies and high stack-up tolerances, typically digital disk drives and fiber optics modules. It is reinforced with fiberglass for easy material handling and added durability during assembly. It has reduced tack on one side, allowing for burn-in processes and easy rework.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Features
- Silicone-free
- Service/operating temperature: -60°C to 125°C (-76°F to 257°F)
- Electrically isolating
- Thermal conductivity: 2.0 W/m-K
- Green, silicone-free, thermally conductive pad
Specifications
Storage temperature: 25.0 °C
Operating temperature: -60.0 °C - 125.0 °C
Shelf life: 12.0 mon.
Color: Green
Standard thickness: 0.254 mm - 3.175 mm
Thermal conductivity: 2.0 W/mK
Carrier type: Fiberglass
General Information
| Item Name | BERGQUIST® GAP PAD® TGP 2200SF |
General Features
| Shelf Life | 12 MON |
Physical Properties
| Container Type | Sheet |
| Pad Type | Gap Pad |
Supporting Information
| Use With | Thermal management, gap pads, Thermal management |
Documents
No Documents Found