Henkel BERGQUIST® GAP PAD® TGP 2000, MFR ID 2166458
- EIS #BERG2166458
$257.45 / Sheet
Available to Order
Min QTY1QTY Increment1
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BERGQUIST® GAP PAD® TGP 2000 is highly conformable, so the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Compliance & Handling
Dangerous Goods: No Dangerous Good
Features
- Thermal conductivity: 2.0 W/m-K
- Low thermal resistance at very low pressures
- Designed for low-stress applications
- Highly conformable
- Low hardness
- Thermally conductive, reinforced pad for low-stress applications
Specifications
Dielectric constant, @ 1kHz: 6.0
Thermal conductivity: 2.0 W/mK
Flame rating: V-0
Dielectric breakdown voltage: 5000.0 Vac
Color: Gray
Volume resistivity: 1×10 Ohm m
Standard thickness: 0.508 mm - 3.175 mm
Operating temperature: -60.0 °C - 200.0 °C
General Information
| Item Name | BERGQUIST® GAP PAD® TGP 2000 |
General Features
| Shelf Life | 12 MON |
Performance Details
| Heat Resistance | 0.6 J/g-K |
Physical Properties
| Container Type | Sheet |
| Density | 2.9 g/cm³ |
| Hardness | 30 |
| Pad Type | Gap Pad |
Supporting Information
| Use With | Thermal management, silicone pads, Thermal management, gap pads, Thermal management |
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