Henkel BERGQUIST® SIL PAD® TSP 3500, MFR ID 2165821
- EIS #BERG2165821
$512.49 / Sheet
Available to Order
Min QTY1QTY Increment1
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BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Compliance & Handling
Dangerous Goods: No Dangerous Good
Temperature Conditions: CH
Features
- Thermal impedance: 0.33°C (32.6°F) -in2/W at 50 psi
- High thermal conductivity 3.5 W/m-K
- Optimal heat transfer
- Easy to use and rework
- Electrically insulating pad - high performance
Specifications
Technology: Silicone
Standard thickness: 0.254 mm - 0.508 mm
Flame rating: V-0
Thermal conductivity: 3.5 W/mK
Color: White
Carrier type: Fiberglass
Operating temperature: -60.0 °C - 200.0 °C
General Information
| Item Name | BERGQUIST® SIL PAD® TSP 3500 |
General Features
| Shelf Life | 12 MON |
Physical Properties
| Container Type | Sheet |
| Pad Type | Sil Pad |
Supporting Information
| Use With | Specialties, others, Thermal management, circuits and substrates, Thermal management, sil pads |
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