SOLDERING SOLUTIONS
for PCB Assembly & Electronics ManufacturingSolder is the foundation of all modern electronics assembly, enabling strong electrical and mechanical connections across PCB assemblies, wire terminations, and power electronics. Whether you're operating a high-throughput SMT line or hand-soldering components in a repair setting, choosing the right solder materials and support products directly impacts quality, yield, and efficiency. EIS supports these needs with a broad portfolio of soldering solutions trusted across the electronics manufacturing industry.
Choose the Right Alloy Format for Your Process
When selecting an alloy, consider factors like soldering temperature profiles, board finish compatibility, and resistance to thermal or mechanical stress. Lead-free compliance may also be required depending on application needs. These considerations help ensure reliable joints, fewer defects, and consistent production performance.
| Type | Application | Benefit |
|---|---|---|
| Solder Bar | Used in wave soldering and solder pots for high-volume production. | Delivers stable melt properties, low dross, high throughput |
| Solder Wire | Ideal for hand soldering and rework. Available in rosin-core, no-clean, or solid core variants. * | Fast wetting, excellent tip flow, operator control |
| Solder Paste | Designed for surface-mount reflow soldering. Combines powdered alloy with flux for stencil printing or dispensing. | Consistent release, transfer efficiency, fine coverage |
*Available in Sn63/Pb37, SAC305, and other leaded/lead-free alloys. Select rosin-core, no-clean, or solid-core variants for process compatibility.
Tools and Materials Behind a Stable Soldering Line
Effective soldering is more than selecting the right alloy, it depends on a fully optimized ecosystem of tools and chemical support. These products and materials play critical roles in ensuring repeatable results, process control, and defect reduction across PCB manufacturing environments:
- Soldering stations with digital displays ensure precise tip temperature control, minimizing cold joints and thermal shock on multilayer and heat-sensitive PCBs.
- ESD-safe models protect components during rework and hand assembly.
- Fume extractors remove airborne flux and rosin particulates, supporting compliance with OSHA exposure limits and IPC-A-610D process environment guidelines.
- Flux promotes metal wetting and oxide removal at the solder joint interface. Available in RA, No-Clean, and Water-Soluble formulations to support varying cleanliness specs and post-solder processing.
- Thinners maintain fluid performance and extend usage in spray and selective fluxing systems, reducing bridging and voids.
- Acts as a protective coating over PCB surfaces, preventing accidental bridging during waves and reflow soldering.
- Defining precise solderable areas around fine-pitch ICs, BGA pads, and plated through-holes, helping maintain spacing integrity.
- Also plays a role in insulation resistance, conformal coating adhesion, and surface protection during wash cycles or handling.
- Defoamers prevent air bubble formation in spray flux systems, ensuring uniform wetting.
- System cleaners and antioxidants reduce flux buildup, extend nozzle and flux tank life, and maintain solder joint quality over long runs.
Reliable Assembly Starts with Engineered Solder Solutions
EIS partners with industry leaders including Kester, MicroCare, Kurtz Ersa, and Chemtronics provide a vetted portfolio of soldering materials trusted in high-reliability, IPC-compliant manufacturing environments. Our offerings support SMT reflow, wave solder, and hand soldering applications across diverse industries.
Engineered for Reliability. Trusted by Electronics Experts.
Contact our team to align your application with our optimal soldering solutions.
