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Thermal Adhesives & Materials

  • 1(current)
  • 2
Displaying 1 - 21 of 26 products found
  • Loctite 315 Thermally Conductive Adhesive, 25mL Syringe, Blue

    ID: LOC31520
    Mfr ID: 31520
    Loctite 315 is a self-shimming thermally conductive, one-part adhesive for bonding electrical components to heat sinks with an insulating gap. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair.

     

  • Loctite 384 Thermal Adhesive, 25mL Syringe, White

    ID: LOC20286
    Mfr ID: 20286
    Loctite 384 Thermal Adhesive.

     

  • Loctite 5404 Thermally Conductive Adhesive, 300mL Cartridge, White

    ID: LOC26665
    Mfr ID: 26665
    SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink.

     

  • Insulcast 140FR Epoxy Heat Sink Compound, 1 gal Can, Black

    ID: INS140FRG
    Mfr ID: 140FRG
    Insulcast 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties.

     

  • Insulcast 3230LV Epoxy Thermally Conductive System, 1 gal Can, Black

    ID: INS3230LVBG
    Mfr ID: 3230LVBG
    Insulcast 3230LV is a low viscosity, highly filled epoxy formulation which, in addition to having excellent electrical properties, has unusually high thermal conductivity with low thermal expansion.

     

  • Parker 65-00 Therm-A-Form™ Cho-Therm® Thermally Conductive Silicone

    Multiple item options available
    Mfr ID: 65-00
    Therm-A-Form thermally conductive silicone elastomer products are dispensable forming place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing and degassing procedures.

     

  • Aremco 835 Ceramabond™ Ceramic Adhesive, 1 qt Bottle, White

    ID: ARE835Q
    Mfr ID: 835
    Aremco's high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles and composite materials used in design, process and maintenance applications to 3200 deg F.

     

  • Parker 61-15-0808-1671 Cho-Therm® High Power Thermal Insulator Pad, 8" L x 8" W x 0.38 mm T, White

    ID: CHOTHERM167103
    Mfr ID: 61-15-0808-1671
    Cho-Therm 61-15-0808-1671 high-power thermal insulator pads are thermally conductive materials designed for use where the highest possible thermal, dielectric and mechanical properties are required. Fiberglass cloth reinforcement strengthens Cho-Therm pads against tear, cut-through and punctures. These materials are available in sheet form and die-cut configurations.

     

  • Novagard G644 Thermally Conductive Compound, 1 pt Can, White, 12/Case

    ID: NOVG644P
    Mfr ID: G644P
    Mfr: Novagard
    Novagard G644 is a heat transfer compound that is formulated with select polydimethyl siloxane fluids in combination with metallic oxide fillers to provide superior thermal conductivity.

     

  • Loctite 3872 Thermally Conductive Adhesive, 300mL Cartridge, Light Gray

    ID: LOC23985
    Mfr ID: 23985
    Loctite 3872 is a self-shimming, thermally conductive acrylic which cures to a low modulus thermoset adhesive. It is designed to provide almost instantaneous fixturing by UV fillet curing to prevent horizontal movement during handling prior to and during the full heat cure process.

     

  • Loctite 3874 Thermally Conductive Adhesive, 25mL Syringe, Gray

    ID: LOC30579
    Mfr ID: 30579
    Loctite 3874 is a thermally conductive adhesive. When used with activator 7387 it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer. The thixotropic nature of Loctite 3874 reduces the migration of liquid product after application to the substrate.

     

  • Loctite PSX-D Thermal Gel, 55cc Syringe, Gray

    ID: LOC1695226
    Mfr ID: 1695226
    Loctite PSX-D Thermal Gel.

     

  • 3M TC2707 Thermally Conductive Adhesive, 37mL Cartridge, Gray, 12/Case

    ID: 3MATC2707
    Mfr ID: 62266114354
    3M thermally conductive epoxy adhesive TC-2707 is a thermally conductive 2-part epoxy using aluminum metal fillers for good thermal conductivity with high adhesion.

     

  • Dow Corning 3-6605 Sylgard® Thermally Conductive Elastomer, 1.8kg Kit, Gray

    ID: DC3-6605X1.8KG
    Mfr ID: 3-6605X1.8KG
    The heat-cure, thermally conductive adhesives produce no by-products in the cure process, allowing their use in deep section and complete confinement. These adhesives will develop good, primerless adhesion to a variety of common substrates including metals, ceramics, epoxy laminate boards, reactive materials and filled plastics. Electronic devices are continually designed to deliver higher performance. Especially in the area of consumer electronics, there is also a continual trend towards smaller, more compact designs.

     

  • Dow Corning SE4486 Thermally Conductive Adhesive, 330mL Cartridge, White

    ID: DCSE4486X330ML
    Mfr ID: SE4486X330ML
    Dow Corning SE 4486 thermally conductive adhesive is designed to provide efficient thermal transfer for the cooling of electronic modules, including home appliance devices.

     

  • Dow Corning 340 Heat Sink Compound

    Multiple item options available
    Mfr ID: 340
    Dow Corning brand thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Electronic devices are continually designed to deliver higher performance.

    In Stock

  • Parker 62-15-0808-1671 Cho-Therm® High Power Thermal Insulator Pad, 8" L x 8" W x 0.38 mm T, White

    ID: CHOTHERM167102
    Mfr ID: 62-15-0808-1671
    Cho-Therm 62-15-0808-1671 high-power thermal insulator pads are thermally conductive materials designed for use where the highest possible thermal, dielectric and mechanical properties are required. Fiberglass cloth reinforcement strengthens Cho-Therm pads against tear, cut-through and punctures. These materials are available in sheet form and die-cut configurations.

    In Stock

  • Novagard G635 Dielectric Silicone Compound, 5.3 oz Tube

    ID: NOVG6355.3OZ
    Mfr ID: G6355.3OZ
    Mfr: Novagard
    Novagard G635 is an amorphous fumed silica thickened, methyldiphenyl polysiloxane based compound. The very broad operating temperature range typical of phenyl-modified silicone fluids characterizes G635.

    In Stock

  • Novagard G624 Dielectric Silicone Compound, 5.3 oz Tube

    ID: NOVG6245.3OZ
    Mfr ID: G6245.3OZ
    Mfr: Novagard
    Novagard G624 is an amorphous fumed silica thickened, polysiloxane based compound. Originally formulated to conform with the specifications outlined in SAE AS-8660, Novagard G624 is an excellent water barrier with superior corrosion protection properties.

    In Stock

  • Novagard G661 General Purpose Dielectric Silicone Compound, 5.3 oz Tube

    ID: NOVG6615.3OZ
    Mfr ID: G661
    Mfr: Novagard
    Novagard G661 is a grease-like material formulated with select polydimethyl siloxane fluids in combination with inert, amorphous silica fillers. Complies with FDA regulation 21 CFR Section 178.3570 Lubricants with incidental food contact.

    In Stock

  • Novagard G641 Thermally Conductive Compound

    Multiple item options available
    Mfr ID: G641
    Mfr: Novagard
    Novagard G641 designed for use as a heat transfer compound in both the electrical and the electronic industries, characterized by its high thermal conductivity, high dielectric constant and high dissipation factor, G641 is an ideal material for use in thermocouple wells, power diodes, transistors, semi-conductors, ballasts among various other applications.

    In Stock

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