Vigon SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. Based on the MPC Technology, the cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers. - It is designed for the use in spray-in-air and ultrasonic cleaning systems and is also recommended for cleaning misprinted solder paste. Depending on the type of fluxes, Vigon SC 200 can also be suggested for both double-sided and single-sided soldered circuit boards applications.
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Vigon SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. Based on the MPC Technology, the cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers. - It is designed for the use in spray-in-air and ultrasonic cleaning systems and is also recommended for cleaning misprinted solder paste. Depending on the type of fluxes, Vigon SC 200 can also be suggested for both double-sided and single-sided soldered circuit boards applications.
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Container Size:
25 L
EIS Part #:
0330-0025-ZES
$ / Can
Container Size:
5 L
EIS Part #:
0320-0005-ZES
$ / Can
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Attributes
Features
Attributes
General Information
Item NameStencil Cleaner
Trade NameVigon®
SeriesSC 200
General Features
StandardsREACH, RoHS, WEEE Compliant
Shelf Life60 Months
Storage Temperature5 to 30 °C
Design & Construction
Base TypeButyl
Performance Details
RemovesSolder Paste, SMT or Conductive Adhesives, Water Soluble Flux Residues, Lead-Free Fluxes
Chemical Properties
pH RatingNeutral
Physical Properties
Container TypeJerry Can
Features
High bath loading capability, very good filterability and therefore a long bath life as well as low maintenance costs
Recommended for ambient cleaning temperatures
Water-based cleaner without flash point, no explosion-proof protection required
Due to its mild formula, the medium shows excellent material compatibility with stencils
Applicable in closed-loop systems
No foaming when used in spray-in-air systems
Low odor, no building of organics in the rinsing section