MFR #:230618
EIS #:LOC23985
Series #:3872
MFR #:230618
EIS #:LOC23985
Series #:3872
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Min Qty:1
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Loctite 3872 is a self-shimming, thermally conductive acrylic which cures to a low modulus thermoset adhesive. It is designed to provide almost instantaneous fixturing by UV fillet curing to prevent horizontal movement during handling prior to and during the full heat cure process. LOCTITE® 3872 is a self-shimming, thermally conductive acrylic which cures to a low modulus thermoset adhesive. It is designed to provide almost instantaneous fixturing by UV fillet curing to prevent horizontal movement during handling prior to and during the full heat cure process. A uniform bondline thickness of 0.127mm results from the incorporation of solid glass spheres. This product combines high modulus and high shear strength with good electrical isolation and high thermal conductivity. Recommended applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. A typical application would be the bonding of of a silicon chip to a metal lead frame. This product is recommended over the high modulus product in applications which see wide thermal cycle.
$247.64 / each
Min Qty:1
|Qty Increment:1
more info
Loctite 3872 is a self-shimming, thermally conductive acrylic which cures to a low modulus thermoset adhesive. It is designed to provide almost instantaneous fixturing by UV fillet curing to prevent horizontal movement during handling prior to and during the full heat cure process. LOCTITE® 3872 is a self-shimming, thermally conductive acrylic which cures to a low modulus thermoset adhesive. It is designed to provide almost instantaneous fixturing by UV fillet curing to prevent horizontal movement during handling prior to and during the full heat cure process. A uniform bondline thickness of 0.127mm results from the incorporation of solid glass spheres. This product combines high modulus and high shear strength with good electrical isolation and high thermal conductivity. Recommended applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. A typical application would be the bonding of of a silicon chip to a metal lead frame. This product is recommended over the high modulus product in applications which see wide thermal cycle.
- Attributes
- Applications
Attributes
General Information
Item NameThermally Conductive Adhesive
Trade NameHenkel
SeriesLOC-3872
General Features
Shelf Life6 Months
Storage Temperature8 to 28 °C
Design & Construction
ColorLight Gray
Cure TypeUltraviolet (UV) Light/Heat Cure
FormPaste
Performance Details
Tensile Strength554 psi
Full Cure Time10 min at 140 °C
Chemical Properties
CompositionAcrylic Urethane
Specific Gravity2.5
Electrical Properties
Dielectric Strength23.62kV/mm
Physical Properties
Container Size300mL
Container TypeCartridge
Elongation30%
Hardness71 Shore D
Environmental Condition
Temperature Rating-54 to 150 °C
Applications
- For Bonding Transformers, Transistors and Other Heat Generating Electronic Components to Printed Circuit Board Assemblies or Heat Sinks