Dow Corning 1-4173 One-Part Thermally Conductive Adhesive, 30mL Cartridge, Gray
ID: DC1-4173X30ML | Mfr ID: 1-4173-30mlManufactured by: Dow Corning
Dow Corning 1-4173 heat-cure, thermally conductive adhesives produce no by-products in the cure process, allowing their use in deep section and complete confinement. These adhesives will develop good, primerless adhesion to a variety of common substrates including metals, ceramics, epoxy laminate boards, reactive materials and filled plastics.
Container Size
USD $64.93 / CRT
- Brand name : Dowcorning
- Series : 1-4173
- Item Name : Thermally Conductive Adhesive
- Short Desc : ADHESIVE,CONDUCTIVE,TC 1-4173 30ML CRT
- UNSPSC : 31201600
Long-term, reliable protection of sensitive circuits and components is important in many of today's delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing.
Performance Details
| Full Cure Time | 90 min at 100 deg C |
| Elongation | 20% |
| Shear Strength | 650 psi |
| Tensile Strength | 900 psi |
Design & Construction
| Form | Liquid |
| Color | Gray |
| Cure Type | Heat Cure |
Environmental Condition
| Temperature Rating | -45 to 200 deg C |
Electrical Properties
| Dielectric Strength | 16.7kV/mm |
| UL Rating | UL94 V-0 |
Supporting Information
| Applicable Materials | Ceramics, Plastics |
Chemical Properties
| Composition | Silicone Elastomer |
| Specific Gravity | 2.7 |
| Viscosity | 61000 cP |
Physical Properties
| Container Size | 30mL |
| Container Type | Cartridge |
| Odor/Scent | Slight |
| Hardness | 92 Shore A |
Dow Corning 1-4173 One-Part Thermally Conductive Adhesive, 30mL Cartridge, Gray Technical Data Sheet
Features :
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Heat flow away from electronic components can increase reliability
- Flowable
- Good thermal conductivity
- No added solvents
Applications :
- For Bonding Integrated Circuit Substrates, Adhering Lids and Housings, Base Plate Attach, Heat Sink Attach, Automated or Manual Dispensing