text.skipToContent text.skipToNavigation

Dow Corning 1-4173 One-Part Thermally Conductive Adhesive, 1.5kg Cartridge, Gray

ID: DC1-4173X1.5KG Mfr ID: 1-4173-1.5kg
Manufactured by: Dow Corning
Dow Corning 1-4173 heat-cure, thermally conductive adhesives produce no by-products in the cure process, allowing their use in deep section and complete confinement. These adhesives will develop good, primerless adhesion to a variety of common substrates including metals, ceramics, epoxy laminate boards, reactive materials and filled plastics.

Container Size

USD $450.71 / CRT

 Future Availability 

This item may be sold in units of 1.

  • Brand name :  Dowcorning
  • Series :  1-4173
  • Item Name :  Thermally Conductive Adhesive
  • Short Desc :  ADHESIVE,CONDUCTIVE,TC 1-4173 1.5KG CRT
  • UNSPSC :  31201600

Long-term, reliable protection of sensitive circuits and components is important in many of today's delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing.

Performance Details
Full Cure Time 90 min at 100 deg C 
Elongation 20% 
Shear Strength 650 psi 
Tensile Strength 900 psi 
Design & Construction
Form Liquid 
Color Gray 
Cure Type Heat Cure 
Environmental Condition
Temperature Rating -45 to 200 deg C 
Electrical Properties
Dielectric Strength 16.7kV/mm 
UL Rating UL94 V-0 
Supporting Information
Applicable Materials Ceramics, Plastics 
Chemical Properties
Composition Silicone Elastomer 
Specific Gravity 2.7 
Viscosity 61000 cP 
Physical Properties
Container Size 1.5kg 
Container Type Cartridge 
Odor/Scent Slight 
Hardness 92 Shore A 

Dow Corning 1-4173 One-Part Thermally Conductive Adhesive, 1.5kg Cartridge, Gray Technical Data Sheet 

Dow Corning 1-4173 One-Part Thermally Conductive Adhesive, 1.5kg Cartridge, Gray Material Safety Data Sheet (MSDS) 

Features :

  • Rapid, versatile cure processing controlled by temperature
  • Able to flow, fill or self-leveling after dispensing
  • Heat flow away from electronic components can increase reliability
  • Flowable
  • Good thermal conductivity
  • No added solvents

Applications :

  • For Bonding Integrated Circuit Substrates, Adhering Lids and Housings, Base Plate Attach, Heat Sink Attach, Automated or Manual Dispensing