MFR #:544029
EIS #:LOC37679
Series #:LOC-3627
MFR #:544029
EIS #:LOC37679
Series #:LOC-3627
Out of Stock
Min Qty:1
|Qty Increment:1
Pack:2/Carton
more info
Loctite 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. The product is also suitable for stencil print applications. LOCTITE 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
$560.57 / Cartridge
Pack: 2/Carton
Min Qty:1
|Qty Increment:1
Pack:2/Carton
more info
Loctite 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. The product is also suitable for stencil print applications. LOCTITE 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
Product Options
Showing 2 out of 2 options
Container Size: 300mL | Container Type: Semco Cartridge | EIS Part #: LOC37679 | $ / Cartridge Pack: 2/Carton | ||
Container Size: 10mL | Container Type: Iwashita Syringe | EIS Part #: LOC37671 | $ / Piece |
- Attributes
- Applications
- Features
Attributes
General Information
Item NameSurface Mount Adhesive
Trade NameHenkel
SeriesLOC-3627
General Features
Storage Temperature2 to 8 °C
TypeOne-Part
Design & Construction
ColorRed
Cure TypeHeat Cure
FormLiquid, Paste
Performance Details
Full Cure Time90 sec at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity1.353
Viscosity2 - 5 Pa at 25 °C
Physical Properties
Container Size300mL
Container TypeSemco Cartridge
Density1.16g/cc
Odor/ScentCharacteristic
Supporting Information
Application MethodStencil Print
Applications
- For the Bonding of Surface Mounted Devices to Printed Circuit Boards Prior to Wave Soldering
Features
- Fast cure formula
- High wet strength
- Dek Pro-Flow compatible
- Lead-free compatible