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Nitto P-222 Polyimide Solder Masking Tape, 4-1/2" x 36 yd x 3.7 Mil, Amber

ID: P-222X4.5 Mfr ID: P-222X4.5
Manufactured by: Nitto
Nitto P-222 amber is for heavy-duty, high temperature applications where a 1-mil polyimide will not provide adequate strength or physical protection. Nitto's Kapton high performance backing ensures consistent quality. Tough backing provides the ultimate in tensile strength, tear, puncture and abrasion resistances.

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USD $374.70 / RL

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1-11 $374.70 / RL
12-23 $336.47 / RL
24-47 $305.31 / RL
48+ $255.90 / RL

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  • Brand name :  Nitto
  • Series :  P-222
  • Item Name :  Solder Masking Tape
  • Short Desc :  TAPE,P-222 4.500"X36YD ROLL AMB
  • UNSPSC :  31201503

Nitto P-222 is a versatile tape and is used as the primary insulation in high performance, flexible wiring boards and heater blanket assemblies. Superior physical and electrical properties are retained at higher temperatures.

Performance Details
Adhesive Strength 26  oz/Inch
Tensile Strength 71  lb/Inch
Elongation 90% 
Design & Construction
Color Amber 
Adhesive Type Silicone 
Backing Material Polyimide 
Shape Roll 
General Features
Storage Temperature 10 to 27 deg C 
Environmental Condition
Temperature Rating 180  deg C
Resists Puncture, Tear, Abrasion 
Flame Retardant Yes 
Electrical Properties
Dielectric Strength 13000  V
Physical Properties
Length 36  Yard
Thickness 3.7  Mil
Width 4.5  Inch
Core Size 3 Inch 

Nitto P-222 Polyimide Solder Masking Tape, 4-1/2" x 36 yd x 3.7 Mil, Amber Technical Data Sheet 

Features :

  • Aggressive high temperature silicone adhesive is also solvent resistant
  • High dielectric strength for critical insulating requirements
  • Our kapton high performance backing ensures consistent quality
  • Used as the primary insulation in high performance flexible wiring circuit boards
  • Used in heater blanket assemblies in pick up and holding of ferrite cores during wiring into computer memories for anchoring leads and terminal boards and as a lead and terminal board insulating pad

Applications :

  • For Printed Circuit Boards During the Wave Soldering or Solder Dipping Process, used in Heater Blanket Assemblies in Pick Up and Holding of Ferrite Cores During Wiring into Computer Memories for Anchoring Leads and Terminal Boards and as a Lead and Terminal Board Insulating Pad