CHR 2345-1-E Polyimide Solder Masking Tape
MFR #:2345-1-E
EIS #:PH22-2345-1-E
MFR #:2345-1-E
EIS #:PH22-2345-1-E
Saint-Gobain 2345-1-E polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100 to 500 °F. These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. - 2345-1-E has a silicone adhesive. Polyimide tape applications include electrical insulation, capacitor, transformer and coil wrapping, electronic assembly and wave solder protection.
$4.88
- $13.87
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Saint-Gobain 2345-1-E polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100 to 500 °F. These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. - 2345-1-E has a silicone adhesive. Polyimide tape applications include electrical insulation, capacitor, transformer and coil wrapping, electronic assembly and wave solder protection.
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Width: 0.25 Inch | EIS Part #: OAK2345-1EX.25 | $ / Roll |
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameSolder Masking Tape
Series2345-1-E
Design & Construction
Adhesive TypeSilicone
Backing MaterialPolyimide
ColorAmber
Performance Details
Adhesive Strength20 oz/Inch
Breaking Strength30 lb/Inch
Flame RetardantYes
Tensile Strength30 lb/Inch
Electrical Properties
Dielectric Strength6500 V
Physical Properties
Elongation80%
Length36 Yard
Thickness2.5 mil
Environmental Condition
ResistsHeat, Solvent, Abrasion
Temperature Rating180 °C
Features
- Electrical grade has excellent mechanical and electrical properties as well as a high conformability
- Offers outstanding resistance to cut-through and is impact and abrasion resistant
- Offers excellent dielectric strength, while the burning of the adhesive forms a non-conductive ash
- Polyimide backing meets MIL-P-46112B
Applications
- For Holding, Insulating or Wrapping and Gold Finger Protection During Wave Solder