text.skipToContent text.skipToNavigation

CHR K290 ESD Polyimide Solder Masking Tape, 1/4" x 36 yd x 2.5 Mil, Amber

ID: N273959X.25 Mfr ID: N273959X.25
Manufactured by: Saint-Gobain
CHR K290ESD has excellent electrostatic discharge properties. Saint-Gobain polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100 to 500 deg F. These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance.

Width

 

In Stock

 Future Availability 

This item may be sold in units of 1.

Order Form
  • Brand name :  Chr
  • Series :  K290 ESD
  • Item Name :  Solder Masking Tape
  • Short Desc :  TAPE,K290ESD .250"X 36YD AMB
  • UNSPSC :  31201503

CHR K290ESD can safely and cleanly be removed from printed circuit boards. Polyimide tape applications include electrical insulation, capacitor, transformer and coil wrapping, electronic assembly and wave solder protection.

Performance Details
Adhesive Strength 20  oz/Inch
Tensile Strength 30  lb/Inch
Elongation 50% 
Design & Construction
Color Amber 
Adhesive Type Silicone 
Backing Material Polyimide 
General Features
Shelf Life 6 Months 
Environmental Condition
Temperature Rating 500  deg F
Resists Heat, Solvent, Abrasion, UV 
Flame Retardant Yes 
Electrical Properties
Dielectric Strength 7000  V
Physical Properties
Length 36  Yard
Thickness 2.5  Mil
Width 0.25  Inch

CHR K290 ESD Polyimide Solder Masking Tape, 1/4" x 36 yd x 2.5 Mil, Amber Technical Data Sheet 

CHR K290 ESD Polyimide Solder Masking Tape, 1/4" x 36 yd x 2.5 Mil, Amber Catalog 

CHR K290 ESD Polyimide Solder Masking Tape, 1/4" x 36 yd x 2.5 Mil, Amber Safety Data Sheet (SDS) 

Features :

  • Available with or without a liner
  • Can safely and cleanly be removed from printed circuit boards
  • Excellent dielectric strength and high conformability
  • Excellent electrostatic discharge (ESD) properties
  • Offers excellent mechanical and electrical properties, plus excellent dielectric strength
  • Proprietary adhesive system provides high electrostatic dissipation without sacrificing adhesive strength at extreme temperatures
  • Constructed to fill the requirements of a high performance thermoplastic polyimide backing material
  • Temperature rating of -100 to 500 deg F

Applications :

  • For Gold Finger Protection During Wave Solder and Reduced Electrostatic Discharge (ESD) Upon Tape Removal