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Dow Corning 170FCK Sylgard® Silicone Elastomer, 210mL Kit, Black/Beige

ID: DC170FCX210ML Mfr ID: 170FC-210ML-A&B
Manufactured by: Dow Corning
Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with good flowability and flame resistance, faster cure at room temperature and a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications.

USD $150.93 / KT

 Future Availability 

This item may be sold in units of 1.

  • Brand name :  Dowcorning
  • Trade Name :  Sylgard®
  • Series :  170FCK
  • Item Name :  Silicone Elastomer
  • Short Desc :  FAST CURE,170 A&B,KIT,210ML-KIT,BLACK
  • UNSPSC :  31201712

Sylgard 170 fast cure silicone elastomer kit is suitable for use as a general potting material for industrial controls, high voltage resistor packs, power supplies, relays, sensors and connectors.

Design & Construction
Cure Type Room Temperature/Heat Cure 
Form - Part-A Liquid 
Form - Part-B Liquid 
Color - Part-A Black 
Color - Part-B Beige 
Performance Details
Full Cure Time 0.2 hr at 25 deg C 
Environmental Condition
Temperature Rating -45 to 200 deg C 
Electrical Properties
Dielectric Strength 350V/Mil 
UL Rating UL746 C, UL94 V-0 
Chemical Properties
Composition - Part-A Silicone 
Composition - Part-B Silicone 
Specific Gravity - Part-A 1.38 
Specific Gravity - Part-B 1.38 
Viscosity - Part-A 5000 sq-mm/sec 
Viscosity - Part-B 2500 sq-mm/sec 
Supporting Information
Application Method Automated Metered Mixing and Dispensing, Manual Mixing 
Physical Properties
Container Size 210mL 
Container Type Kit 
Hardness 41.45 Shore A 
Odor/Scent - Part-A Slight 
Odor/Scent - Part-B Slight 

Dow Corning 170FCK Sylgard® Silicone Elastomer, 210mL Kit, Black/Beige Technical Data Sheet 

Dow Corning 170FCK Sylgard® Silicone Elastomer, 210mL Kit, Black/Beige Safety Data Sheet (SDS) 

Dow Corning 170FCK Sylgard® Silicone Elastomer, 210mL Kit, Black/Beige Safety Data Sheet (SDS) 

Features :

  • Low viscosity
  • Rapid room temperature or heat accelerated cure
  • Moderate thermal conductivity
  • Rapid, versatile cure processing controlled by temperature
  • Shorter room temperature cure reduces cycle time
  • Low viscosity enhances flow and fill in narrow spaces and around complex geometries
  • Can be considered for uses requiring added flame resistance
  • Fast cure formula

Applications :

  • For use as a General Potting Material for Power Supplies, Connectors, Sensors, Industrial Controls, Transformers, Amplifiers, High Voltage Resistor Packs, Relays