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Dow Corning R-6101 Hipec® One-Part Semiconductor Protective Coating, 453g Bottle, Clear

ID: DCR-6101X453G Mfr ID: R-6101X453G
Manufactured by: Dow Corning
Dow Corning silicone encapsulants are designed to meet the key criteria for the micro- and optoelectronic packaging industry, including excellent adhesion, high purity, moisture resistance and thermal and electrical stability.
Special Handling Required



USD $807.34 / BOT

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This item may be sold in units of 1.

  • Brand name :  Dowcorning
  • Trade Name :  Hipec®
  • Series :  R-6101
  • Item Name :  Semiconductor Protective Coating
  • Short Desc :  COATING,HIPEC R-6101 453G CRT
  • UNSPSC :  31201700

With their low Young's modulus, these materials can absorb the stress caused by CTE mismatches inside the package, protecting the chip and the bonding wires.

WARNING

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov

Performance Details
Full Cure Time 120 min at 150 deg C 
Design & Construction
Form Liquid 
Color Clear 
Cure Type Heat Cure 
Electrical Properties
Dielectric Strength 475V/Mil 
Chemical Properties
Composition Silicone 
Specific Gravity 1.04 
Viscosity 6000 sq-mm/sec 
Supporting Information
Application Method Manual or Automated Dispense 
Physical Properties
Container Size 453g 
Container Type Bottle 
Hardness 31 Shore A 

Dow Corning R-6101 Hipec® One-Part Semiconductor Protective Coating, 453g Bottle, Clear Safety Data Sheet (SDS) 

Dow Corning R-6101 Hipec® One-Part Semiconductor Protective Coating, 453g Bottle, Clear Technical Data Sheet 

Features :

  • Low levels of ionic impurities
  • 1-part formulation
  • Clear optical performance
  • Addition cure chemistry
  • Low modulus of elasticity
  • Die coating for wire bond packaging

Applications :