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Dow Corning R-6101 Hipec® One-Part Semiconductor Protective Coating, 453g Bottle, Clear

ID: DCR-6101X453G Mfr ID: R-6101X453G
Manufactured by: Dow Corning
Dow Corning silicone encapsulants are designed to meet the key criteria for the micro- and optoelectronic packaging industry, including excellent adhesion, high purity, moisture resistance and thermal and electrical stability.

USD $775.99 / BOT

In Stock

 Future Availability 

This item may be sold in units of 1.

Order Form
  • Brand name :  Dowcorning
  • Trade Name :  Hipec®
  • Series :  R-6101
  • Item Name :  Semiconductor Protective Coating
  • Short Desc :  COATING,HIPEC R-6101 453G CRT
  • UNSPSC :  31201700

With their low Young's modulus, these materials can absorb the stress caused by CTE mismatches inside the package, protecting the chip and the bonding wires.

Performance Details
Full Cure Time 120 min at 150 deg C 
Design & Construction
Form Liquid 
Color Clear 
Cure Type Heat Cure 
Electrical Properties
Dielectric Strength 475V/Mil 
Chemical Properties
Composition Silicone 
Specific Gravity 1.04 
Viscosity 6000 sq-mm/sec 
Supporting Information
Application Method Manual or Automated Dispense 
Physical Properties
Container Size 453g 
Container Type Bottle 
Hardness 31 Shore A 

Dow Corning R-6101 Hipec® One-Part Semiconductor Protective Coating, 453g Bottle, Clear Safety Data Sheet (SDS) 

Dow Corning R-6101 Hipec® One-Part Semiconductor Protective Coating, 453g Bottle, Clear Technical Data Sheet 

Features :

  • Low levels of ionic impurities
  • 1-part formulation
  • Clear optical performance
  • Addition cure chemistry
  • Low modulus of elasticity
  • Die coating for wire bond packaging

Applications :