MFR #:NP505LT-SN42
EIS #:PH19-NP505LT-SN42
Series #:NP505-LT
MFR #:NP505LT-SN42
EIS #:PH19-NP505LT-SN42
Series #:NP505-LT
Kester NP505-LT is a no-clean, Pb-free, zero-halogen solder paste with excellent activity, printability and has extremely stable paste properties that is excellent for temperature sensitive substrates and components. - Kester NP505-LT is a no-clean, Pb-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the trend of using thinner and larger packages and boards. The defects caused by the warpage may decrease board reliability and increase in rework. NP505-LT is designed to reduce warpage inherent to board-to-package.
$149.14
- $188.96
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Kester NP505-LT is a no-clean, Pb-free, zero-halogen solder paste with excellent activity, printability and has extremely stable paste properties that is excellent for temperature sensitive substrates and components. - Kester NP505-LT is a no-clean, Pb-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the trend of using thinner and larger packages and boards. The defects caused by the warpage may decrease board reliability and increase in rework. NP505-LT is designed to reduce warpage inherent to board-to-package.
Product Options
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Container Size: 600 g | Container Type: Cartridge | Particle Type: Type 4 | EIS Part #: SN42NP505LT-600GT4 | $ / Cartridge | ||
Container Size: 500 g | Container Type: Jar | Particle Type: Type 4 | EIS Part #: SN42NP505LT-500GT4 | $ / Piece |
- Attributes
- Features
Attributes
General Information
Item NameSolder Paste
SeriesNP505-LT
Design & Construction
Particle TypeType 4
Chemical Properties
Flux FormulaNP505-LT
Lead FreeYes
Physical Properties
AlloySn42 Ag1 Bi57
Features
- Classified ROL0 per IPC J-STD-004B
- Zero-Halogen (none intentionally added)
- Low reflow peak temperatures (175-215�C)
- Reduced reflow temperatures improving efficiency in energy and cost
- Reduction in board-to-package warpage
- Low voiding potential under QFNs (less than 15%)
- Wide reflow profile window with good solderability on various PCB surface finish
- Excellent activity and printability
- Extremely stable paste properties
- Colorless residues for easy post-reflow inspection