MFR #:373041
EIS #:LOCFP8004-V71
Series #:LOC-3568
MFR #:373041
EIS #:LOCFP8004-V71
Series #:LOC-3568
Out of Stock
Min Qty:1
|Qty Increment:1
WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
Loctite 3568 One-Part Potting Compound. LOCTITE® 3568™ is an epoxy based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and µBGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165 °C, is easy to dispense, and quickly penetrates gaps as small as 0.025 mm. This underfill is designed to provide processing and reliability similar to conventional thermoset underfills, with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210 to 220 °C for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, and this allows removal of the component when torque is applied.
$191.22 / Piece
Min Qty:1
|Qty Increment:1
WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
Loctite 3568 One-Part Potting Compound. LOCTITE® 3568™ is an epoxy based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and µBGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165 °C, is easy to dispense, and quickly penetrates gaps as small as 0.025 mm. This underfill is designed to provide processing and reliability similar to conventional thermoset underfills, with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210 to 220 °C for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, and this allows removal of the component when torque is applied.
- Attributes
- Applications
Attributes
General Information
Item NamePotting Compound
Trade NameHenkel
SeriesLOC-3568
General Features
TypeOne-Part
Design & Construction
ColorBlack
Cure TypeHeat Cure
FormLiquid
Chemical Properties
CompositionEpoxy
VOC301gal/L
Physical Properties
Container Size10mL
Applications
- For Reworkable Underfill for CSP, BGA and Micro BGA Assemblies