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October Shop & Earn
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Loctite 3568 One-Part Potting Compound, 10mL, Black

The image shown is representative of the product family and may not specifically be the individual item.  Loctite HYDX-20 is a high activity, flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables …

MFR #:373041

EIS #:LOCFP8004-V71

Series #:LOC-3568

MFR #:373041

EIS #:LOCFP8004-V71

Series #:LOC-3568

Out of Stock

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
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Loctite 3568 One-Part Potting Compound. LOCTITE® 3568™ is an epoxy based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and µBGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165 °C, is easy to dispense, and quickly penetrates gaps as small as 0.025 mm. This underfill is designed to provide processing and reliability similar to conventional thermoset underfills, with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210 to 220 °C for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, and this allows removal of the component when torque is applied.
$171.27 / Piece

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
0
0
Loctite 3568 One-Part Potting Compound. LOCTITE® 3568™ is an epoxy based liquid underfill compatible with polyimide and silicon nitride passivated flip-chip, CSP, BGA and µBGA assemblies. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165 °C, is easy to dispense, and quickly penetrates gaps as small as 0.025 mm. This underfill is designed to provide processing and reliability similar to conventional thermoset underfills, with the added advantage of reworkability: when heated to high temperatures for short periods of time (typically 210 to 220 °C for 1 minute) the cured epoxy matrix undergoes physical and chemical transformations, and this allows removal of the component when torque is applied.

Attributes

General Information
Item NamePotting Compound
Trade NameHenkel
SeriesLOC-3568
General Features
TypeOne-Part
Design & Construction
ColorBlack
Cure TypeHeat Cure
FormLiquid
Chemical Properties
CompositionEpoxy
VOC301gal/L
Physical Properties
Container Size10mL