Kester EM808-SAC305-88 Type 3 Lead-Free Solder Paste
MFR #:EM808-SAC305-88
EIS #:PH19-EM808-SAC305-88
Series #:EM808-SAC305-88
MFR #:EM808-SAC305-88
EIS #:PH19-EM808-SAC305-88
Series #:EM808-SAC305-88
The Kester EM808 is a lead-free, organic acid, water soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, EM808 provides hr of stable stencil life, tack time and repeatable brick definition. - EM808 robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the EM808 is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards.
$67.36
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The Kester EM808 is a lead-free, organic acid, water soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, EM808 provides hr of stable stencil life, tack time and repeatable brick definition. - EM808 robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the EM808 is very aggressive and provides superior wetting to OSP coated and Immersion Silver boards.
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 | Container Size: 600 g | Container Type: Cartridge | EIS Part #: SN965AG3EM808-600G | $ / Piece |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameLead-Free Solder Paste
SeriesEM808-SAC305-88
General Features
Shelf Life6 Months
Storage Temperature0 to 10 °C
TypeLead-Free
Design & Construction
ColorSilver Gray
FormPaste
Flux TypeOrganic Activated or Water Soluble
Particle TypeType 3
Chemical Properties
Flux FormulaEM808
Mesh Size-325/+500
Physical Properties
Odor/ScentMild
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Environmental Condition
Melting Range317 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorORM0
RoHS Info2011/65/EU Directive
Features
- Provides outstanding batch-to-batch consistency
- Residues easily removed with hot DI water, even up to 48 hr after soldering
- stencil life of 8+ hr
- Capable of 60+ min idle times in printing
- Contains halogen
- Compatible with enclosed print head systems
- Excellent anti-slump characteristics minimizing bridging defects
- Excellent solderability to a wide variety of metallizations, including palladium, leaving bright, shiny joints
- Lead-free and water soluble
- Minimal foam in wash systems
- Print speed up to 150 mm/sec (6 Inch/sec)
- Metals percentage of 88%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications