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Elantas Electrical Insulation E-6203 Epoxylite® High Temperature Potting Compound, 1 pt Kit

ID: EPO6203P Mfr ID: E 6203 P
Manufactured by: ELANTAS PDG, Inc.
Epoxylite E 6203 hi-temp epoxy is a heat-cured, two-component system consisting of a viscous liquid resin and a finely divided powder hardener. It is provided in pre measured kits. Maintains excellent electrical and physical properties to at least 260 deg C / 500 deg F. Potting and sealing of electrical and electronic components requiring resistance to high temperatures.

Container Size

USD $457.19 / EA

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1-12 $457.19 / EA
13-24 $384.04 / EA
25+ $331.06 / EA

32  In Stock

 Future Availability 

This item may be sold in units of 1.

Order Form
  • Brand name :  Elantas
  • Trade Name :  Epoxylite®
  • Series :  E-6203
  • Item Name :  Potting Compound
  • Short Desc :  RESIN,ULTRA HI TEMP,E 6203 1-LB/PINT KIT
  • UNSPSC :  31201600

This product withstands temperatures in excess of 316 deg C / 600 deg F for short periods. Excellent adhesion to metals, ceramics and most plastics. Resistant to acids, alkalis and solvents. Low outgassing per NASA reference GSFC5006.

Performance Details
Full Cure Time See TDS 
Elongation <2% 
Shear Strength 2500 psi at 25 deg C, 500 psi at 260 deg C 
Tensile Strength 4000 psi 
Design & Construction
Form - Part-A Liquid 
Cure Type Heat Cure 
Electrical Properties
Dielectric Strength 560V/Mil 
Chemical Properties
Composition - Part-A Modified Epoxy Resin 
Viscosity - Part-A 20000 - 40000 cP 
Supporting Information
Applicable Materials Metals, Ceramics, Plastics 
Application Method Bench Casting, Vacuum Casting 
Physical Properties
Container Size 1 pt 
Container Type Kit 
Hardness 90 Shore D 

Elantas Electrical Insulation E-6203 Epoxylite® High Temperature Potting Compound, 1 pt Kit Safety Data Sheet (SDS) 

Elantas Electrical Insulation E-6203 Epoxylite® High Temperature Potting Compound, 1 pt Kit Brochure 

Elantas Electrical Insulation E-6203 Epoxylite® High Temperature Potting Compound, 1 pt Kit Technical Data Sheet 

Features :

Applications :

  • For Potting and Sealing of Electrical and Electronic Components Requiring Resistance to High Temperatures