text.skipToContent text.skipToNavigation

Cytec Industries EN-12 Conathane® Conap® Part B Molding and Encapsulating System, 1 gal, Translucent Amber

ID: CONEN12BG Mfr ID: EN12BG
Manufactured by: Cytec Industries
Conathane EN-11 and EN-12 are two-component, highly flexible liquid polyurethane molding and encapsulating systems that ensure the performance of electrical/electronic assemblies exposed to severe environmental extremes. Elastomers prepared from these systems exhibit the outstanding properties. These systems have also shown exceptional adhesion to a wide variety of substrates.

USD $582.90 / GL

Buy more and save

3-4 $531.32 / GL
5-9 $480.31 / GL
10+ $451.42 / GL

Check availability 

This item may be sold in units of 2.

  • Brand name :  Cytec
  • Trade Name :  Conathane®, Conap®
  • Series :  EN-12
  • Item Name :  Molding and Encapsulating System
  • Short Desc :  EN-12 ENAPSULANT,CONAP,PART B 1-GAL
  • UNSPSC :  31201700

The systems are recommended for cable and connector potting and molding - both military and commercial, electronic module potting, wire wound device encapsulation and strain sensitive component potting. Their excellent moisture resistance also suggests their use as 100% solids thick-film coatings for printed circuitry or, because of their solubility in most commercially available solvents, as flexible thin-film coatings.

Performance Details
Full Cure Time See TDS 
Elongation 350% 
Tensile Strength 400 psi 
Design & Construction
Form - Part-B Liquid 
Color - Part-B Translucent Amber 
Cure Type Room Temperature 
Environmental Condition
Temperature Rating -65 to 130 deg C 
Electrical Properties
Dielectric Strength 600V/Mil 
Chemical Properties
Composition - Part-B Polyurethane 
Specific Gravity - Part-B 0.99 
Viscosity - Part-B 6000 cP 
Physical Properties
Container Size 1 gal 
Hardness 50 Shore A 

Cytec Industries EN-12 Conathane® Conap® Part B Molding and Encapsulating System, 1 gal, Translucent Amber Technical Data Sheet 

Features :

  • Superior hydrolytic stability
  • Non-MbOCA curing systems
  • Excellent flexibility
  • Low dielectric constant
  • Low viscosity
  • Thermal shock resistant (-70 to 135 deg C)
  • Exceptionally high dielectric strength (600V/min)
  • Fungus resistance

Applications :