MFR #:62379793300
EIS #:3MA3797PG
Series #:3797
UPC #:00021200825927
MFR #:62379793300
EIS #:3MA3797PG
Series #:3797
UPC #:00021200825927
Out of Stock
Min Qty:1
|Qty Increment:1
Pack:22 lb/Case
more info
Our 3M™ Hot Melt Adhesive 3797 is a temperature resistant, low viscosity adhesive which flows easily into small areas for effective coverage and protection, ideal for electrical potting. This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. It is best used with our 3M™ Hot Melt Applicator PG II – excellent for high volume operations. - This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. Long open times allow for easy use on large assemblies and large surfaces.
Requires Quote / US pound
Min Qty:1
|Qty Increment:1
Pack:22 lb/Case
more info
Our 3M™ Hot Melt Adhesive 3797 is a temperature resistant, low viscosity adhesive which flows easily into small areas for effective coverage and protection, ideal for electrical potting. This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. It is best used with our 3M™ Hot Melt Applicator PG II – excellent for high volume operations. - This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. Long open times allow for easy use on large assemblies and large surfaces.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameHot Melt Adhesive
Trade Name3M
Series3797
General Features
Shelf Life24 Months
Standards21 CFR 175.105 Certified
Storage Temperature49 °C
Design & Construction
ColorOff White
Performance Details
Shear Strength350 psi
Heat ResistanceYes
Open Time30 sec
Chemical Properties
CompositionPolypropylene
Viscosity2650 cP
Electrical Properties
UL RatingUL94 V-2
Physical Properties
Odor/ScentResinous
Size3 Inch L x 1 Inch W
Environmental Condition
Temperature Rating350 to 385 °F
Supporting Information
Applicable MaterialsMetals, Wood, Glass, Vinyl, Plastics
Application MethodHandheld process
Features
- Hot melt adhesive ideal for potting of electrical and electronic components
- Low viscosity provides high flow rate for excellent coverage
- Ball and ring tested - adhesive exhibits good temperature resistance after application
- 30 sec bead open time makes for effective potting at depth
- For use with 3M hot melt applicator PG II, allowing for fast paced production
- Easy-to-use
- Adhesive sets and obtains strength in seconds
- Creates high performance bonds
- Ideal for wood working and general industrial applications
- 10 piw peel strength
Applications
- For Electrical Potting, Securing Wires, Bundling Wires, Rigidizing Components on Printed Circuit Boards, Terminating Coils, Cable Strain Relief