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Loctite Electronics

Materials solution provider for semiconductor and electronics assembly, including semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions. Adhesives for electronics, from films, Chip-On-Board (COB) encapsulants and low-pressure molding materials to solder amterials, thermal management materials and underfills, are provided by Loctite-Electronics.

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Displaying 1 - 21 of 64 products found
  • Loctite 680290 Lead-Free Bar Solder, Sn99.3 Cu0.7, 2.5 lb

    ID: HEN680290
    Mfr ID: 680290
    BAR 99C alloy is designed to be lead-free substitutes for tin/lead alloys in all electronics assembly soldering operations.

    In Stock

  • Loctite GC-10-SAC305-88.5 Solder Paste

    Multiple item options available
    Mfr ID: GC-10-SAC305-88.5
    In what is a true market break-through, Henkel has developed the first-ever temperature stable solder paste. Loctite GC 10 is stable at 26.5 deg C for one year and at temperatures of up to 40 deg C for one month, providing benefits throughout the logistics and operations chain, while still offering unbeatable printability and reflow performance.

    In Stock

  • Loctite 981501 Lead-Free Bar Solder, Sn96.5 Ag3.0 Cu0.5 (SAC305), 2.5 lb

    ID: HEN981501
    Mfr ID: 981501
    Multicore 97SC (SAC305) alloy is designed to be a lead-free substitute for tin/lead alloys in most electronics assembly soldering operations. It meets or exceeds QQ-S-571, J-STD-006 and JIS Z 3282 Class A requirements.

    In Stock

  • Loctite 554889 Leaded Bar Solder, Sn63 Pb37, 2 lb

    ID: HEN554889
    Mfr ID: 554889
    Eutectic Sn-Pb alloy. Improved yields, especially on densely populated boards. Special alloy composition improves flow and reduces oxide formation for more consistent results. Bright solder joints. Low impurity levels increase life of alloy in the solder bath and reduce bath maintenance. Passes IPC/EIA J-STD-006B requirements.

    In Stock

  • Loctite M00272 Hydro-X/20 Organic Activated Soldering Flux, 5 gal, Green

    ID: HENM00272
    Mfr ID: M00272
    Loctite HYDX-20 is a high activity, flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables a wider process window and the soldering of all common electronic surfaces with ease.

     

  • Loctite 2651-40 Hysol® Stycast™ Two-Part Low Viscosity Encapsulant

    Multiple item options available
    Mfr ID: LOC-2651-40
    Stycast 2651-40 is a two-component, easy-to-use, low viscosity, epoxy encapsulant with excellent adhesion to metals, plastics and ceramics. It can be cured at room or elevated temperature. Its viscosity at room temperature is approximately 30 Pa prior to addition of catalyst.

    In Stock

  • Loctite 3621 Chipbonder® One-Part Surface Mount Adhesive

    Multiple item options available
    Mfr ID: LOC-3621
    Loctite 3621 surface mount adhesive is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required.

    In Stock

  • Loctite 384 Thermal Adhesive, 25mL Syringe, White

    ID: LOC20286
    Mfr ID: 20286
    Loctite 384 Thermal Adhesive.

     

  • Loctite 1265 Stycast™ Encapsulant

    Multiple item options available
    Mfr ID: 1265
    Stycast 1265 A/B is a clear, two-component epoxy gel. It is tough, has a hardness of 25 shore A and a long pot life. The Stycast 1265 A/B has excellent adhesion to a wide variety of substrates and can be cut easily for repairing and replacing components. Fresh material can be poured and then cured to form a perfect repair.

     

  • Loctite Hysol® Conformal Coating

    Multiple item options available
    Mfr ID: LOC-12-007
    Hysol PC12-007M is a 100% solids, general purpose, epoxy printed circuit coating developed to meet military requirements. Its long successful history has proved it to be an outstanding coating with maximum electrical and ruggedization properties. The coating is suitable for continuous operation up to 275 deg F and may be used on any substrate offering good adhesion. It is suggested that stress-sensitive components, such as diodes, be sleeved prior to coating.

     

  • Loctite 2101 Tra-Bond Epoxy Adhesive, 2g Kit, Clear

    ID: TRABA2101
    Mfr ID: 1188351
    Tra-Bond 2101 is a medium viscosity epoxy formulation recommended for laminating, bonding, repair and other adhesive applications where the combination of its superior structural, mechanical and electrical performance properties are required.

     

  • Loctite 5421 Conductive Adhesive, 50mL Cartridge, Tan

    ID: LOC32728
    Mfr ID: 5421
    Loctite 5421 is an RTV silicone that provides EMI/RFI shielding on electronic device enclosures.

     

  • Loctite 3404 Hysol® Stycast™ Epoxy Hardener, 1 gal, Amber

    ID: LOCHD3404-B50G
    Mfr ID: HD3404
    Hysol HD3404 is a two-component, low viscosity, high heat distortion, potting and encapsulating epoxy with low shrinkage, low expansion, good strength and excellent electrical properties.

     

  • Loctite 348 Chipbonder® High Viscosity Surface Mount Adhesive, 10mL EFD Syringe, Orange

    ID: LOC17723
    Mfr ID: 17723
    Loctite 348 surface mount adhesive (Chipbonder) is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium- to high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required.

    In Stock

  • Loctite 3568 One-Part Potting Compound, 10mL, Black

    ID: LOCFP8004-V71
    Mfr ID: FP8004-V71
    Loctite 3568 One-Part Potting Compound.

    In Stock

  • Loctite 3609 Chipbonder® One-Part Surface Mount Adhesive

    Multiple item options available
    Mfr ID: LOC-3609
    Loctite 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.

    In Stock

  • Loctite 3614 Chipbonder® Varidot™ One-Part Surface Mount Adhesive, 300mL Semco Cartridge, Red

    ID: LOC26652
    Mfr ID: 26652
    Loctite 3614 is single part epoxy adhesive which cures rapidly on exposure to heat. It is designed to give excellent dot size and shape control when applied using Loctite Varidot stencil printing technology.

     

  • Loctite 3615 Chipbonder® One-Part Surface Mount Adhesive, 10mL EFD Syringe, Red

    ID: LOC28565
    Mfr ID: 28565
    Loctite 3615 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium print speeds, high dot profile, high wet strength and good electrical characteristics are required.

     

  • Loctite 3616 Chipbonder® One-Part Surface Mount Adhesive

    Multiple item options available
    Mfr ID: LOC-3616
    Loctite 3616 surface mount adhesive is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.

    In Stock

  • Loctite 384 Output Thermal Adhesive, 25mL Syringe, White

    ID: LOC17099
    Mfr ID: 17099
    Loctite 384 is a repairable, room temperature-curing adhesive utilized for parts subject to disassembly.

    In Stock

  • Loctite 384 Repairable Kit, 25mL Syringe, White

    ID: LOC21087
    Mfr ID: 21087
    Loctite 384 ODC Free Repairable Kit. For bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

    In Stock

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