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Dow 340 Heat Sink Compound, 9kg Pail, White

The image shown is representative of the product family and may not specifically be the individual item.

MFR #:1608410

EIS #:DC340X9KG

Series #:340

MFR #:1608410

EIS #:DC340X9KG

Series #:340

Temporarily Out of Stock

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
more info
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Dow Corning brand thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Electronic devices are continually designed to deliver higher performance. - Especially in the area of consumer electronics, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of electronic devices is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device.
$1,316.46 / Pail

Min Qty:1

  |  

Qty Increment:1

WARNING: California Proposition 65 - Cancer and Reproductive Harm - www.P65Warnings.ca.gov
more info
0
0
Dow Corning brand thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Electronic devices are continually designed to deliver higher performance. - Especially in the area of consumer electronics, there is also a continual trend towards smaller, more compact designs. In combination these factors typically mean that more heat is generated in the device. Thermal management of electronic devices is a primary concern of design engineers. A cooler device allows for more efficient operation and better reliability over the life of the device.

Product Options

Showing 3 out of 3 options
The image shown is representative of the product family and may not specifically be the individual item.
Container Size
9kg
EIS Part #
DC340X9KG
$ / Pail
The image shown is representative of the product family and may not specifically be the individual item.
Container Size
382g
EIS Part #
DC340X382G
$ / Cartridge
The image shown is representative of the product family and may not specifically be the individual item.
Container Size
142g
EIS Part #
DC340X142G
$ / TUBE
Pack12/Carton

Attributes

General Information
Item NameHeat Sink Compound
Series340
General Features
Shelf Life60 Months
StandardsWEEE/RoHS Compliant
Design & Construction
ColorWhite
FormPaste
Performance Details
Evaporation Rate0.38%
Chemical Properties
CompositionSilicone
Specific Gravity2.1
Viscosity542000 cP
Electrical Properties
Dielectric Strength210V/Mil
Physical Properties
Container Size9kg
Container TypePail