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Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin, 5 gal, Black

ID: DOLCB110945LB Mfr ID: DOLCB110945LB
Manufactured by: Von Roll / John C Dolph
Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin, Room Temperature Cure Type, 665 V/Mil Dielectric Strength, 180% Elongation, 24 hr Full Cure Time, 1100+/-20 g/Liter At 25 deg C Specific Gravity, 300 psi Tensile Strength, 0.33/0.36 W/mK Thermal Conductivity, 4500/8500 cps Viscosity.

Container Size

USD $20.04 / LB

Buy more and save

45-89 $20.04 / LB
90-224 $18.61 / LB
225-449 $17.09 / LB
450+ $16.54 / LB

In Stock

This item may be sold in units of 45.

  • Brand name :  Von Roll John Cdolph
  • Trade Name :  Dolphon®
  • Series :  Dolphon® CB-1109
  • Item Name :  Flexible Polybutadiene Resin
  • Short Desc :  RESIN,CB-1109 EPOXY 5-GAL PAIL/45LB BLK
  • UNSPSC :  13101719

CB-1109 is a unique, flexible resin. an alternative to silicone, urethane and epoxy resins, it can be used for potting, casting and coating electrical and electronic device applications where flexibility is required.

Performance Details
Elongation 180% 
Full Cure Time 24 hr 
Tensile Strength 300  psi
Thermal Conductivity 0.33  W/mK
Design & Construction
Color Black 
Cure Type Room Temperature 
General Features
Type Two-Part 
Electrical Properties
Dielectric Strength 665  V/Mil
Chemical Properties
Specific Gravity 1100  g/L
Viscosity 4500  cP
Physical Properties
Container Size 5  gal
Container Type Pail 

Features :

  • Remains flexible at temps from -72 to 200 deg C
  • Thermal shock resistance - passes over 30 cycles (olyphant washer test)
  • Hydrolytically stable (100 deg C @ 95% RH)
  • Very low moisture vapor transmission
  • Excellent electrical properties - minimal change throughout temperature range
  • Repairable
  • Low shrinkage, low embedment stress
  • Easy mix and pour (hand or automatic dispensing)
  • Room temperature cure (thick sections or thin layers) - can be used as stress relief layer
  • Low viscosity
  • Excellent adhesion properties
  • Excellent chemical and abrasion resistance - resists degreaser solvent, very low exotherm
  • 14 PLI tear strength
  • -72 deg C low temperature flexibility
  • 6.1 x 10^-5 Inch/Inch/deg C thermal expansion
  • Viscosity: 4500 - 8500 cP

Applications :

  • Modules
  • Sensors
  • Relays
  • Coils
  • Ferrite Cores
  • Transformers
  • Amplifiers
  • Power Supplies
  • Ground Fault Interrupters
  • Complete Electronic Assemblies
  • Connectors
  • Junction Boxes
  • Splice Filling
  • Cable Repair
  • Motors