CB-1109 is a unique, flexible resin. an alternative to silicone, urethane and epoxy resins, it can be used for potting, casting and coating electrical and electronic device applications where flexibility is required. Von Roll/John C Dolph Dolphon® CB-1109 Two-Part Flexible Polybutadiene Resin, Room Temperature Cure Type, 665 V/Mil Dielectric Strength, 180% Elongation, 24 hr Full Cure Time, 1100+/-20 g/Liter At 25 °C Specific Gravity, 300 psi Tensile Strength, 0.33/0.36 W/mK Thermal Conductivity, 4500/8500 cps Viscosity.